Hartmut Buenning

Person

Hamburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of making a semiconductor device
- Patent number 11,011,446
- Issue date May 18, 2021
- Nexperia B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with six-sided protected walls
- Patent number 10,410,922
- Issue date Sep 10, 2019
- NXP B.V.
- Hartmut Buenning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable stealth laser dicing process
- Patent number 10,347,534
- Issue date Jul 9, 2019
- NXP B.V.
- Martin Lapke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma dicing with blade saw patterned underside mask
- Patent number 9,847,258
- Issue date Dec 19, 2017
- NXP B.V.
- Thomas Rohleder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combination grinding after laser (GAL) and laser on-off function to...
- Patent number 9,812,361
- Issue date Nov 7, 2017
- NXP B.V.
- Hartmut Buenning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching and stealth dicing laser process
- Patent number 9,601,437
- Issue date Mar 21, 2017
- NXP B.V.
- Guido Albermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, device and method for wafer dicing
- Patent number 9,349,645
- Issue date May 24, 2016
- NXP B.V.
- Martin Lapke
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Using a double-cut for mechanical protection of a wafer-level chip...
- Patent number 9,245,804
- Issue date Jan 26, 2016
- NXP B.V.
- Christian Zenz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection of a wafer-level chip scale package (WLCSP)
- Patent number 9,196,537
- Issue date Nov 24, 2015
- NXP B.V.
- Leonardus Antonius Elisabeth Van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated wafer-level chip scale (WLSCP) pedestal packaging
- Patent number 8,987,057
- Issue date Mar 24, 2015
- NXP B.V.
- Leonardus Antonius Elisabeth Van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die preparation for wafer-level chip scale package (WLCSP)
- Patent number 8,895,363
- Issue date Nov 25, 2014
- NXP B.V.
- Hartmut Buenning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High die strength semiconductor wafer processing method and system
- Patent number 8,809,166
- Issue date Aug 19, 2014
- NXP B.V.
- Hartmut Buenning
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VARIABLE STEALTH LASER DICING PROCESS
- Publication number 20190080963
- Publication date Mar 14, 2019
- NXP B.V.
- Martin LAPKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SIX-SIDED PROTECTED WALLS
- Publication number 20180240707
- Publication date Aug 23, 2018
- NXP B.V.
- Hartmut Buenning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE
- Publication number 20170148697
- Publication date May 25, 2017
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DICING WITH BLADE SAW PATTERNED UNDERSIDE MASK
- Publication number 20170092540
- Publication date Mar 30, 2017
- NXP B.V.
- Thomas ROHLEDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MATERIAL REMOVAL
- Publication number 20160172243
- Publication date Jun 16, 2016
- NXP B.V.
- SASCHA MOELLER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLASMA ETCHING AND STEALTH DICING LASER PROCESS
- Publication number 20160071770
- Publication date Mar 10, 2016
- NXP B.V.
- Guido ALBERMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED WAFER-LEVEL CHIP SCALE (WLSCP) PEDESTAL PACKAGING
- Publication number 20150162306
- Publication date Jun 11, 2015
- NXP B.V.
- Leonardus Antonius Elisabeth VAN GEMERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, DEVICE AND METHOD FOR WAFER DICING
- Publication number 20150104931
- Publication date Apr 16, 2015
- NXP B.V.
- Martin Lapke
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
COMBINATION GRINDING AFTER LASER (GAL) AND LASER ON-OFF FUNCTION TO...
- Publication number 20150069578
- Publication date Mar 12, 2015
- NXP B.V.
- Hartmut BUENNING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Preparation for Wafer-Level Chip Scale Package (WLCSP)
- Publication number 20140264768
- Publication date Sep 18, 2014
- NXP B.V.
- Hartmut Buenning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DIE STRENGTH SEMICONDUCTOR WAFER PROCESSING METHOD AND SYSTEM
- Publication number 20140179083
- Publication date Jun 26, 2014
- NXP B.V.
- HARTMUT BUENNING
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTION OF A WAFER-LEVEL CHIP SCALE PACKAGE (WLCSP)
- Publication number 20140138855
- Publication date May 22, 2014
- NXP B.V.
- Leonardus Antonius Elisabeth VAN GEMERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE PROTECTION FOR A WAFER-LEVEL CHIP SCALE PACKAGE (WLCSP)
- Publication number 20140110826
- Publication date Apr 24, 2014
- NXP B.V.
- Hartmut BUENNING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING A DOUBLE-CUT FOR MECHANICAL PROTECTION OF A WAFER-LEVEL CHIP...
- Publication number 20140110842
- Publication date Apr 24, 2014
- NXP B.V.
- Christian ZENZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED WAFER-LEVEL CHIP SCALE (WLSCP) PEDESTAL PACKAGING
- Publication number 20140091458
- Publication date Apr 3, 2014
- NXP B.V.
- Leonardus Antonius Elisabeth VAN GEMERT
- H01 - BASIC ELECTRIC ELEMENTS

Hartmut Buenning

Person

Patents Grantslast 30 patents

Semiconductor device and method of making a semiconductor device

Semiconductor device with six-sided protected walls

Variable stealth laser dicing process

Plasma dicing with blade saw patterned underside mask

Combination grinding after laser (GAL) and laser on-off function to...

Plasma etching and stealth dicing laser process

Apparatus, device and method for wafer dicing

Using a double-cut for mechanical protection of a wafer-level chip...

Protection of a wafer-level chip scale package (WLCSP)

Encapsulated wafer-level chip scale (WLSCP) pedestal packaging

Die preparation for wafer-level chip scale package (WLCSP)

High die strength semiconductor wafer processing method and system

Patents Applicationslast 30 patents

VARIABLE STEALTH LASER DICING PROCESS

SEMICONDUCTOR DEVICE WITH SIX-SIDED PROTECTED WALLS

SEMICONDUCTOR DEVICE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE

PLASMA DICING WITH BLADE SAW PATTERNED UNDERSIDE MASK

WAFER MATERIAL REMOVAL

PLASMA ETCHING AND STEALTH DICING LASER PROCESS

ENCAPSULATED WAFER-LEVEL CHIP SCALE (WLSCP) PEDESTAL PACKAGING

APPARATUS, DEVICE AND METHOD FOR WAFER DICING

COMBINATION GRINDING AFTER LASER (GAL) AND LASER ON-OFF FUNCTION TO...

Die Preparation for Wafer-Level Chip Scale Package (WLCSP)

HIGH DIE STRENGTH SEMICONDUCTOR WAFER PROCESSING METHOD AND SYSTEM

PROTECTION OF A WAFER-LEVEL CHIP SCALE PACKAGE (WLCSP)

BACKSIDE PROTECTION FOR A WAFER-LEVEL CHIP SCALE PACKAGE (WLCSP)

USING A DOUBLE-CUT FOR MECHANICAL PROTECTION OF A WAFER-LEVEL CHIP...

ENCAPSULATED WAFER-LEVEL CHIP SCALE (WLSCP) PEDESTAL PACKAGING