Hartmut Rohrmann

Person

Schriesheim, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Liquid sputter target
- Patent number 11,952,654
- Issue date Apr 9, 2024
- EVATEC AG
- Dominik Jaeger
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of and apparatus for magnetron sputtering
- Patent number 11,848,179
- Issue date Dec 19, 2023
- EVATEC AG
- Hartmut Rohrmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus and method of processing a substrate...
- Patent number 11,551,950
- Issue date Jan 10, 2023
- EVATEC AG
- Hartmut Rohrmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of and apparatus for magnetron sputtering
- Patent number 11,476,099
- Issue date Oct 18, 2022
- EVATEC AG
- Hartmut Rohrmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a directional layer by cathode sputtering, and...
- Patent number 9,587,306
- Issue date Mar 7, 2017
- EVATEC AG
- Hartmut Rohrmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Target arrangement for mounting / dismounting and method of manufac...
- Patent number 8,540,850
- Issue date Sep 24, 2013
- OC Oerlikon Balzers AG
- Marcel Neusch
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF AND APPARATUS FOR MAGNETRON SPUTTERING
- Publication number 20230014186
- Publication date Jan 19, 2023
- Evatec AG
- Hartmut Rohrmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LIQUID SPUTTER TARGET
- Publication number 20210381099
- Publication date Dec 9, 2021
- Evatec AG
- Dominik Jaeger
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA ENHANCED ATOMIC LAYER DEPOSITION (PEALD) APPARATUS
- Publication number 20210348274
- Publication date Nov 11, 2021
- Evatec AG
- Jörg PATSCHEIDER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF AND APPARATUS FOR MAGNETRON SPUTTERING
- Publication number 20210050193
- Publication date Feb 18, 2021
- Evatec AG
- Hartmut Rohrmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND METHOD OF PROCESSING A SUBSTRATE...
- Publication number 20200388517
- Publication date Dec 10, 2020
- Evatec AG
- Hartmut Rohrmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPUTTERING SOURCE
- Publication number 20190252166
- Publication date Aug 15, 2019
- Evatec AG
- Heinz Felzer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSING ARRANGEMENT WITH TEMPERATURE CONDITIONING ARRANGEMENT AN...
- Publication number 20150228530
- Publication date Aug 13, 2015
- Oerlikon Advanced Technologies AG
- Hartmut Rohrmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MAGNETRON SPUTTERING APPARATUS
- Publication number 20130180850
- Publication date Jul 18, 2013
- OC OERLIKON BALZERS AG
- Hartmut Rohrmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REACTIVE SPUTTERING WITH MULTIPLE SPUTTER SOURCES
- Publication number 20120031749
- Publication date Feb 9, 2012
- OC OERLIKON BALZERS AG
- Martin Dubs
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TARGET ASSEMBLY FOR A MAGNETRON SPUTTERING APPARATUS, A MAGNETRON S...
- Publication number 20110186421
- Publication date Aug 4, 2011
- OC OERLIKON BALZERS AG
- Hanspeter Friedli
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for producing a directional layer by cathode sputtering, and...
- Publication number 20090134011
- Publication date May 28, 2009
- OC Oerlikon Balzers AG
- Hartmut Rohrmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTITARGET SPUTTER SOURCE AND METHOD FOR THE DEPOSITION OF MULTI-L...
- Publication number 20080308412
- Publication date Dec 18, 2008
- OC OERLIKON BALZERS AG
- Hartmut Rohrmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Target arrangement for mounting / dismounting and method of manufac...
- Publication number 20070144899
- Publication date Jun 28, 2007
- Marcel Neusch
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Substrate processing system
- Publication number 20060054495
- Publication date Mar 16, 2006
- Hartmut Rohrmann
- G11 - INFORMATION STORAGE

Hartmut Rohrmann

Person

Patents Grantslast 30 patents

Liquid sputter target

Methods of and apparatus for magnetron sputtering

Substrate processing apparatus and method of processing a substrate...

Methods of and apparatus for magnetron sputtering

Method for producing a directional layer by cathode sputtering, and...

Target arrangement for mounting / dismounting and method of manufac...

Patents Applicationslast 30 patents

METHODS OF AND APPARATUS FOR MAGNETRON SPUTTERING

LIQUID SPUTTER TARGET

PLASMA ENHANCED ATOMIC LAYER DEPOSITION (PEALD) APPARATUS

METHODS OF AND APPARATUS FOR MAGNETRON SPUTTERING

SUBSTRATE PROCESSING APPARATUS AND METHOD OF PROCESSING A SUBSTRATE...

SPUTTERING SOURCE

PROCESSING ARRANGEMENT WITH TEMPERATURE CONDITIONING ARRANGEMENT AN...

MAGNETRON SPUTTERING APPARATUS

REACTIVE SPUTTERING WITH MULTIPLE SPUTTER SOURCES

TARGET ASSEMBLY FOR A MAGNETRON SPUTTERING APPARATUS, A MAGNETRON S...

Method for producing a directional layer by cathode sputtering, and...

MULTITARGET SPUTTER SOURCE AND METHOD FOR THE DEPOSITION OF MULTI-L...

Target arrangement for mounting / dismounting and method of manufac...

Substrate processing system