Harufumi Kobayashi

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing printed-circuit board
- Patent number 8,500,984
- Issue date Aug 6, 2013
- Oki Semiconductor Co., Ltd.
- Yoshimi Egawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double-faced electrode package, and its manufacturing method
- Patent number 8,501,542
- Issue date Aug 6, 2013
- Oki Semiconductor Co., Ltd.
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-faced electrode package and its manufacturing method
- Patent number 8,154,110
- Issue date Apr 10, 2012
- Oki Semiconductor Co., Ltd.
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 6,852,564
- Issue date Feb 8, 2005
- Oki Electric Industry Co, Ltd.
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating resin-encapsulated semiconductor device
- Patent number 6,653,218
- Issue date Nov 25, 2003
- Oki Electric Industry Co, Ltd.
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 6,573,598
- Issue date Jun 3, 2003
- Oki Electric Industry Co, Ltd.
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device
- Patent number 6,495,916
- Issue date Dec 17, 2002
- Oki Electric Industry Co., Ltd.
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and manufacturing method thereof
- Patent number 6,369,440
- Issue date Apr 9, 2002
- Oki Electric Industry Co, Ltd.
- Harufumi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus, circuit board and combination thereof
- Patent number 6,054,757
- Issue date Apr 25, 2000
- Oki Electric Industry Co., Ltd.
- Harufumi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 5,952,710
- Issue date Sep 14, 1999
- Oki Electric Industry Co., Ltd.
- Harufumi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DOUBLE-FACED ELECTRODE PACKAGE, AND ITS MANUFACTURING METHOD
- Publication number 20120164790
- Publication date Jun 28, 2012
- Okisemiconductor Co., Ltd.
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PRINTED-CIRCUIT BOARD
- Publication number 20090321266
- Publication date Dec 31, 2009
- Oki Semiconductor Co., Ltd.
- Yoshimi Egawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DOUBLE-FACED ELECTRODE PACKAGE AND ITS MANUFACTURING METHOD
- Publication number 20090224381
- Publication date Sep 10, 2009
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of fabricating the same
- Publication number 20030092219
- Publication date May 15, 2003
- Oki Electric Industry Co., Ltd.
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating resin-encapsulated semiconductor device
- Publication number 20030071352
- Publication date Apr 17, 2003
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20020167085
- Publication date Nov 14, 2002
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS

Harufumi Kobayashi

Person

Patents Grantslast 30 patents

Method for manufacturing printed-circuit board

Double-faced electrode package, and its manufacturing method

Double-faced electrode package and its manufacturing method

Semiconductor device and method of fabricating the same

Method of fabricating resin-encapsulated semiconductor device

Semiconductor device and method of fabricating the same

Resin-encapsulated semiconductor device

Semiconductor substrate and manufacturing method thereof

Semiconductor apparatus, circuit board and combination thereof

Semiconductor device and method of manufacturing same

Patents Applicationslast 30 patents

DOUBLE-FACED ELECTRODE PACKAGE, AND ITS MANUFACTURING METHOD

METHOD FOR MANUFACTURING PRINTED-CIRCUIT BOARD

DOUBLE-FACED ELECTRODE PACKAGE AND ITS MANUFACTURING METHOD

Semiconductor device and method of fabricating the same

Method of fabricating resin-encapsulated semiconductor device

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME