Haruhiko Hieda

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Connection structure for coaxial connector and multilayer substrate
- Patent number 7,471,174
- Issue date Dec 30, 2008
- Mitsubishi Denki Kabushiki Kaisha
- Haruhiko Hieda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Connection structure for coaxial connector and multilayer substrate
- Publication number 20060049491
- Publication date Mar 9, 2006
- Haruhiko Hieda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR