Haruhiko Matsuyama

Person

Hiratsuka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer wiring substrate and method for production thereof
- Patent number 6,132,852
- Issue date Oct 17, 2000
- Hitachi, Ltd.
- Masahiro Suzuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multilayer wiring board having vent holes and method of making
- Patent number 6,124,553
- Issue date Sep 26, 2000
- Hitachi, Ltd.
- Yasunori Narizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing multilayer wiring board and wiring pattern...
- Patent number 5,970,310
- Issue date Oct 19, 1999
- Hitachi, Ltd.
- Shigemasa Satoh
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 5,958,600
- Issue date Sep 28, 1999
- Hitachi, Ltd.
- Hideo Sotokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metalization structure and manufacturing method thereof
- Patent number 5,868,949
- Issue date Feb 9, 1999
- Hitachi, Ltd.
- Hideo Sotokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure with metal wiring layers and polyimide layers, and...
- Patent number 5,851,681
- Issue date Dec 22, 1998
- Hitachi, Ltd.
- Haruhiko Matsuyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wiring structures and method of manufacturing the same
- Patent number 5,753,372
- Issue date May 19, 1998
- Hitachi, Ltd.
- Hideo Sotokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating an interconnected multilayer board
- Patent number 5,388,328
- Issue date Feb 14, 1995
- Hitachi, Ltd.
- Hitoshi Yokono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnected multilayer boards and fabrication processes thereof
- Patent number 5,300,735
- Issue date Apr 5, 1994
- Hitachi, Ltd.
- Hitoshi Yokono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-resistant bonding materials
- Patent number 5,280,102
- Issue date Jan 18, 1994
- Hitachi, Ltd.
- Haruhiko Matsuyama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Multilayer wiring substrate and production thereof
- Patent number 5,208,656
- Issue date May 4, 1993
- Hitachi, Ltd.
- Haruhiko Matsuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film magnetic head
- Patent number 4,824,731
- Issue date Apr 25, 1989
- Hitachi, Ltd.
- Haruhiko Matsuyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Magnetic bubble memory element
- Patent number 4,772,505
- Issue date Sep 20, 1988
- Hitachi, Ltd.
- Haruhiko Matsuyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing organic silicon-terminated polyimide precurso...
- Patent number 4,748,228
- Issue date May 31, 1988
- Hitachi Ltd.
- Fusaji Shoji
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Magnetic head and method of producing the same
- Patent number 4,686,147
- Issue date Aug 11, 1987
- Hitachi, Ltd.
- Haruhiko Matsuyama
- G11 - INFORMATION STORAGE
Information Patent Grant
Process for producing solar cells
- Patent number 4,643,913
- Issue date Feb 17, 1987
- Hitachi, Ltd.
- Masaaki Okunaka
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Electrode material for semi-conductor devices
- Patent number 4,486,232
- Issue date Dec 4, 1984
- Hitachi, Ltd.
- Mitsuo Nakatani
- H01 - BASIC ELECTRIC ELEMENTS

Haruhiko Matsuyama

Person

Patents Grantslast 30 patents

Multilayer wiring substrate and method for production thereof

Multilayer wiring board having vent holes and method of making

Method for manufacturing multilayer wiring board and wiring pattern...

Circuit board and method of manufacturing the same

Metalization structure and manufacturing method thereof

Wiring structure with metal wiring layers and polyimide layers, and...

Wiring structures and method of manufacturing the same

Process for fabricating an interconnected multilayer board

Interconnected multilayer boards and fabrication processes thereof

Heat-resistant bonding materials

Multilayer wiring substrate and production thereof

Thin film magnetic head

Magnetic bubble memory element

Process for producing organic silicon-terminated polyimide precurso...

Magnetic head and method of producing the same

Process for producing solar cells

Electrode material for semi-conductor devices