Haruhiko Murata

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Aichi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring board
- Patent number 7,067,918
- Issue date Jun 27, 2006
- NGK Spark Plug Co., Ltd.
- Haruhiko Murata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board having solder bumps
- Patent number 6,660,944
- Issue date Dec 9, 2003
- NGK Spark Plug Co., Ltd.
- Haruhiko Murata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed-wiring substrate and method for fabricating the same
- Patent number 6,546,622
- Issue date Apr 15, 2003
- NGK Spark Plug Co., Ltd.
- Masahiro Iba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic lid assembly for semiconductor packages
- Patent number 5,825,086
- Issue date Oct 20, 1998
- NGK Spark Plug Co., Ltd.
- Kazuo Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic package lid having metallized layer with varying widths
- Patent number 5,779,081
- Issue date Jul 14, 1998
- NGK Spark Plug Co., Ltd.
- Kazuo Kimura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wiring board
- Publication number 20040227239
- Publication date Nov 18, 2004
- NGK SPARK PLUG CO., LTD.
- Haruhiko Murata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed-wiring substrate and method for fabricating the same
- Publication number 20010052183
- Publication date Dec 20, 2001
- Masahiro Iba
- H01 - BASIC ELECTRIC ELEMENTS