Haruhito ICHIKAWA

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Kariya-city, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,967,564
- Issue date Apr 23, 2024
- Denso Corporation
- Aiko Kaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer including silicon carbide wafer and method for...
- Patent number 11,348,844
- Issue date May 31, 2022
- Denso Corporation
- Shinya Takei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210151385
- Publication date May 20, 2021
- DENSO CORPORATION
- Aiko KAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER INCLUDING SILICON CARBIDE WAFER AND METHOD FOR...
- Publication number 20210143070
- Publication date May 13, 2021
- DENSO CORPORATION
- Shinya TAKEI
- H01 - BASIC ELECTRIC ELEMENTS