Harumi Yagi

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Yokohama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Heat sink device and method of repairing semiconductor device
- Patent number 9,117,788
- Issue date Aug 25, 2015
- Fujitsu Limited
- Tsuyoshi Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of forming solder bumps and method of forming preformed sold...
- Patent number 6,109,507
- Issue date Aug 29, 2000
- Fujitsu Limited
- Harumi Yagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Twin wire splitter system
- Patent number 4,691,855
- Issue date Sep 8, 1987
- Fujitsu Limited
- Harumi Yagi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF DETACHMENT OF CONNECTOR, CONNECTOR DETACHMENT TOOL, AND C...
- Publication number 20120083151
- Publication date Apr 5, 2012
- Fujitsu Limited
- Rie TAKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK DEVICE AND METHOD OF REPAIRING SEMICONDUCTOR DEVICE
- Publication number 20120024512
- Publication date Feb 2, 2012
- Fujitsu Limited
- Tsuyoshi Yamamoto
- F28 - HEAT EXCHANGE IN GENERAL