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Harunobu SATO
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Nagano-shi, JP
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Patents Grants
last 30 patents
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Patent Grant
Substrate with multi-layer resin structure and semiconductor device...
Patent number
10,943,857
Issue date
Mar 9, 2021
Shinko Electric Industries Co., Ltd.
Kentaro Kaneko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame and semiconductor device
Patent number
9,466,556
Issue date
Oct 11, 2016
Shinko Electric Industries Co., Ltd.
Harunobu Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe for semiconductor device
Patent number
7,329,944
Issue date
Feb 12, 2008
Shinko Electric Industries Co., Ltd.
Kazumitsu Seki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging component and semiconductor package
Patent number
7,190,057
Issue date
Mar 13, 2007
Shinko Electric Industries Co., Ltd.
Kazumitsu Seki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device lead frame
Patent number
6,593,643
Issue date
Jul 15, 2003
Shinko Electric Industries Co., Ltd.
Kazumitsu Seki
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SUBSTRATE FOR SEMICONDUCTOR ELEMENTS AND SEMICONDUCTOR DEVICE
Publication number
20190088578
Publication date
Mar 21, 2019
Shinko Electric Industries Co., Ltd.
Kentaro KANEKO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Lead Frame and Semiconductor Device
Publication number
20140291827
Publication date
Oct 2, 2014
Shinko Electric Industries Co., LTD.
Harunobu SATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Leadframe for semiconductor device
Publication number
20060214272
Publication date
Sep 28, 2006
Shinko Electric Industries Co., Ltd.
Kazumitsu Seki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packaging component and semiconductor package
Publication number
20040232534
Publication date
Nov 25, 2004
SHINKO ELECTRIC INDUSTRIES, CO., LTD.
Kazumitsu Seki
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR