Haruo Itoh

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Shiga-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Determining intra-die wirebond pad placement locations in integrate...
- Patent number 8,448,118
- Issue date May 21, 2013
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DETERMINING INTRA-DIE WIREBOND PAD PLACEMENT LOCATIONS IN INTEGRATE...
- Publication number 20120216164
- Publication date Aug 23, 2012
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS