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Haruo Mishina

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Patents Grantslast 30 patents

  • Information Patent Grant

    Paste applicator having positioning means
    • Patent number 5,932,012
    • Issue date Aug 3, 1999
    • Hitachi Techno Engineering Co., Ltd.
    • Shigeru Ishida
    • B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
  • Information Patent Grant

    Heating furnace
    • Patent number 5,716,207
    • Issue date Feb 10, 1998
    • Hitachi Techno Engineering Co., Ltd.
    • Haruo Mishina
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Apparatus for applying paste
    • Patent number 5,614,024
    • Issue date Mar 25, 1997
    • Hitachi Techno Engineering Co., Ltd.
    • Shigeru Ishida
    • B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
  • Information Patent Grant

    Hot press with pressure vessels to uniformly distribute pressure to...
    • Patent number 5,558,015
    • Issue date Sep 24, 1996
    • Hitachi Techno Engineering Co., Ltd.
    • Akimi Miyashita
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Reflow soldering apparatus for soldering electronic parts to circui...
    • Patent number 5,467,912
    • Issue date Nov 21, 1995
    • Hitachi Techno Engineering Co., Ltd.
    • Haruo Mishina
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Apparatus for drawing paste pattern on substrate
    • Patent number 5,437,727
    • Issue date Aug 1, 1995
    • Hitachi Techno Engineering Co., Ltd.
    • Tomio Yoneda
    • B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
  • Information Patent Grant

    Paste applicator
    • Patent number 5,415,693
    • Issue date May 16, 1995
    • Hitachi Techno Engineering Co., Ltd.
    • Tomio Yoneda
    • B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
  • Information Patent Grant

    Reflow soldering apparatus
    • Patent number 5,358,166
    • Issue date Oct 25, 1994
    • Hitachi Techno Engineering Co. Ltd.
    • Haruo Mishina
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Vapor reflow soldering apparatus
    • Patent number 5,333,774
    • Issue date Aug 2, 1994
    • Hitachi Techno Engineering Co., Ltd.
    • Haruo Mishina
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Reflow soldering method and system therefor
    • Patent number 5,203,487
    • Issue date Apr 20, 1993
    • Hitachi Techno Engineering Co., Ltd.
    • Haruo Mishina
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Screen printer
    • Patent number 5,197,384
    • Issue date Mar 30, 1993
    • Hitachi Techno Engineering Co., Ltd.
    • Satoshi Yawata
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Reflow soldering apparatus
    • Patent number 5,163,599
    • Issue date Nov 17, 1992
    • Hitachi Techno Engineering Co., Ltd.
    • Haruo Mishina
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Vapor reflow type soldering method and apparatus therefor
    • Patent number 5,156,325
    • Issue date Oct 20, 1992
    • Hitachi Techno Engineering Co., Ltd.
    • Haruo Mishina
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Vapor reflow type soldering apparatus
    • Patent number 5,146,694
    • Issue date Sep 15, 1992
    • Hitachi Techno Engineering Co., Ltd.
    • Haruo Mishina
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Vapor reflow type soldering apparatus
    • Patent number 5,038,496
    • Issue date Aug 13, 1991
    • Hitachi Techno Engineering Co., Ltd.
    • Haruo Mishina
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Vapor reflow type soldering apparatus with an improved flux separat...
    • Patent number 4,996,781
    • Issue date Mar 5, 1991
    • Hitachi Techno Engineering Co., Ltd.
    • Haruo Mishina
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Apparatus for fixing electronic parts to printed circuit board
    • Patent number 4,809,443
    • Issue date Mar 7, 1989
    • Hitachi Techno Engineering Co., Ltd.
    • Haruo Mishina
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Apparatus for fixing electronic parts to printed circuit board
    • Patent number 4,776,105
    • Issue date Oct 11, 1988
    • Hitachi Techno Engineering Co., Ltd.
    • Haruo Mishina
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Vapor reflow type soldering apparatus
    • Patent number 4,735,001
    • Issue date Apr 5, 1988
    • Hitachi Techno Engineering Co., Ltd.
    • Haruo Mishina
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR