Haruyuki Yoshii

Person

Niigata, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Liquid resin composition for sealing and electronic component appar...
- Patent number 12,131,970
- Issue date Oct 29, 2024
- Resonac Corporation
- Hidetoshi Inoue
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Liquid sealing material for copper bump, and resin composition for...
- Patent number 10,941,280
- Issue date Mar 9, 2021
- Namics Corporation
- Tomoya Yamazawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Liquid sealing material and electronic component using same
- Patent number 9,805,998
- Issue date Oct 31, 2017
- Namics Corporation
- Seiichi Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid sealing material and electronic component using same
- Patent number 9,748,158
- Issue date Aug 29, 2017
- NAMICS CORPORATION
- Seiichi Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting electronic component and mounting substrate
- Patent number 8,586,467
- Issue date Nov 19, 2013
- Namics Corporation
- Osamu Suzuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flip chip mounting method which avoids void formation between a sem...
- Patent number 6,841,415
- Issue date Jan 11, 2005
- Namics Corporation
- Osamu Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cationically polymerizable resin composition
- Patent number 6,498,200
- Issue date Dec 24, 2002
- Namics Corporation
- Osamu Suzuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT APPAR...
- Publication number 20200194325
- Publication date Jun 18, 2020
- Hitachi Chemical Company, Ltd.
- Hidetoshi INOUE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LIQUID RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COM...
- Publication number 20200181392
- Publication date Jun 11, 2020
- Hitachi Chemical Company, Ltd.
- Hidetoshi INOUE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LIQUID SEALING MATERIAL FOR COPPER BUMP, AND RESIN COMPOSITION FOR...
- Publication number 20170335090
- Publication date Nov 23, 2017
- Tomoya YAMAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID SEALING MATERIAL AND ELECTRONIC COMPONENT USING SAME
- Publication number 20160300772
- Publication date Oct 13, 2016
- Namics Corporation
- Seiichi Ishikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LIQUID SEALING MATERIAL AND ELECTRONIC COMPONENT USING SAME
- Publication number 20150175856
- Publication date Jun 25, 2015
- NAMICS Corporation
- Seiichi Ishikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MOUNTING ELECTRONIC COMPONENT AND MOUNTING SUBSTRATE
- Publication number 20110316149
- Publication date Dec 29, 2011
- Osamu Suzuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Flip chip mounting method
- Publication number 20030059978
- Publication date Mar 27, 2003
- Osamu Suzuki
- H01 - BASIC ELECTRIC ELEMENTS

Haruyuki Yoshii

Person

Patents Grantslast 30 patents

Liquid resin composition for sealing and electronic component appar...

Liquid sealing material for copper bump, and resin composition for...

Liquid sealing material and electronic component using same

Liquid sealing material and electronic component using same

Method of mounting electronic component and mounting substrate

Flip chip mounting method which avoids void formation between a sem...

Cationically polymerizable resin composition

Patents Applicationslast 30 patents

LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT APPAR...

LIQUID RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COM...

LIQUID SEALING MATERIAL FOR COPPER BUMP, AND RESIN COMPOSITION FOR...

LIQUID SEALING MATERIAL AND ELECTRONIC COMPONENT USING SAME

LIQUID SEALING MATERIAL AND ELECTRONIC COMPONENT USING SAME

METHOD OF MOUNTING ELECTRONIC COMPONENT AND MOUNTING SUBSTRATE

Flip chip mounting method