Harvey John Lunsman

Person

Chippewa Falls, WI, US

People

Patents Grantslast 30 patents

Information Patent Grant
System chassis with divider walls having a concave edge
- Patent number 12,207,431
- Issue date Jan 21, 2025
- Hewlett Packard Enterprise Development LP
- Harvey John Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling module and a method of cooling an electronic circuit module...
- Patent number 12,200,902
- Issue date Jan 14, 2025
- Hewlett Packard Enterprise Development LP
- Harvey J. Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Corrugated thermal interface device with lateral spring fingers
- Patent number 12,038,618
- Issue date Jul 16, 2024
- Hewlett Packard Enterprise Development LP
- Harvey John Lunsman
- G02 - OPTICS
Information Patent Grant
Conforming heat transport device for dual inline memory module cool...
- Patent number 11,974,414
- Issue date Apr 30, 2024
- Hewlett Packard Enterprise Development LP
- Ernesto Ferrer Medina
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Photo-etched chassis cooling walls
- Patent number 11,937,407
- Issue date Mar 19, 2024
- Hewlett Packard Enterprise Development LP
- John Franz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contiguous plane infrastructure for computing systems
- Patent number 11,803,216
- Issue date Oct 31, 2023
- Hewlett Packard Enterprise Development LP
- Kevin B. Leigh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling module and a method of assembling the cooling module to an...
- Patent number 11,800,682
- Issue date Oct 24, 2023
- Hewlett Packard Enterprise Development LP
- Harvey J. Lunsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Receptacle with connectable spring finger for multipoint contact co...
- Patent number 11,729,943
- Issue date Aug 15, 2023
- Hewlett Packard Enterprise Patent Department LP
- Harvey J. Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Disconnects
- Patent number 11,711,907
- Issue date Jul 25, 2023
- Hewlett Packard Enterprise Development LP
- John Franz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Leak mitigation system
- Patent number 11,662,126
- Issue date May 30, 2023
- Hewlett Packard Enterprise Development LP
- John Franz
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Void free injection-molded cold plates
- Patent number 11,589,477
- Issue date Feb 21, 2023
- Hewlett Packard Enterprise Development LP
- Harvey Lunsman
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Multipoint contact conduction cooling of a removable device
- Patent number 11,579,668
- Issue date Feb 14, 2023
- Hewlett Packard Enterprise Development LP
- Harvey J. Lunsman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for extended serial temperature control in a c...
- Patent number 11,497,137
- Issue date Nov 8, 2022
- Hewlett Packard Enterprise Development LP
- Tahir Cader
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Magnetic blocks for thermally coupling cooling component and heat s...
- Patent number 11,417,451
- Issue date Aug 16, 2022
- Hewlett Packard Enterprise Development LP
- John Franz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible I/O server interface card orientation
- Patent number 11,406,036
- Issue date Aug 2, 2022
- Hewlett Packard Enterprise Development LP
- Brian T. Purcell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Latch assembly for a modular device
- Patent number 11,284,527
- Issue date Mar 22, 2022
- Hewlett Packard Enterprise Development LP
- Micheal D. Scott
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Leak mitigation in a cooling system for computing devices
- Patent number 11,284,535
- Issue date Mar 22, 2022
- Hewlett Packard Enterprise Development LP
- John Franz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Compute node tray cooling
- Patent number 11,157,050
- Issue date Oct 26, 2021
- Hewlett Packard Enterprise Development LP
- Harvey J. Lunsman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Rack and row-scale cooling
- Patent number 11,152,283
- Issue date Oct 19, 2021
- Hewlett Packard Enterprise Development LP
- John Franz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power supply dry disconnect liquid cooling
- Patent number 10,955,883
- Issue date Mar 23, 2021
- Hewlett Packard Enterprise Development LP
- John Franz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Valved connector
- Patent number 10,941,892
- Issue date Mar 9, 2021
- Hewlett Packard Enterprise Development LP
- Michael Scott
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Pumps with pre-charged fluid
- Patent number 10,893,630
- Issue date Jan 12, 2021
- Hewlett Packard Enterprise Development LP
- Harvey Lunsman
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Leak mitigation system for a cooling system
- Patent number 10,888,023
- Issue date Jan 5, 2021
- Hewlett Packard Enterprise Development LP
- Harvey Lunsman
- G01 - MEASURING TESTING
Information Patent Grant
Electrical and liquid cooling midplane
- Patent number 10,881,030
- Issue date Dec 29, 2020
- Hewlett Packard Enterprise Development LP
- Harvey J. Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling fluids in opposite directions across a device
- Patent number 10,827,649
- Issue date Nov 3, 2020
- Hewlett Packard Enterprise Development LP
- Harvey J. Lunsman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tunable cold plates
- Patent number 10,813,249
- Issue date Oct 20, 2020
- Hewlett Packard Enterprise Development LP
- Ernesto Ferrer Medina
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chassis cooling
- Patent number 10,813,253
- Issue date Oct 20, 2020
- Hewlett Packard Enterprise Development LP
- Harvey Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling system for high-performance computer
- Patent number 10,806,056
- Issue date Oct 13, 2020
- Hewlett Packard Enterprise Development LP
- Bret M. Cuda
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Floating liquid cooled heat transfer solution
- Patent number 10,765,032
- Issue date Sep 1, 2020
- Hewlett Packard Enterprise Development LP
- Harvey John Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual in-line memory module (DIMM) Edgewater Spring (EWS) multi poin...
- Patent number 10,763,191
- Issue date Sep 1, 2020
- Hewlett Packard Enterprise Development LP
- John Franz
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
LEVER ACTUATED COLD PLATE
- Publication number 20250048595
- Publication date Feb 6, 2025
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Harvey J. Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING MODULE AND A METHOD OF COOLING AN ELECTRONIC CIRCUIT MODULE...
- Publication number 20250024636
- Publication date Jan 16, 2025
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Harvey J. Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELASTOMER EMBEDDED MULTIPOINT CONTACT COOLING
- Publication number 20240397667
- Publication date Nov 28, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Harvey J. Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORRUGATED THERMAL INTERFACE DEVICE WITH LATERAL SPRING FINGERS
- Publication number 20240329342
- Publication date Oct 3, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Harvey John Lunsman
- G02 - OPTICS
Information Patent Application
SYSTEM CHASSIS WITH DIVIDER WALLS HAVING A CONCAVE EDGE
- Publication number 20240298419
- Publication date Sep 5, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Harvey John Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUID COUPLINGS WITH MAGNETIC LATCH ASSEMBLY
- Publication number 20240256011
- Publication date Aug 1, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- John Paul Franz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONFORMING HEAT TRANSPORT DEVICE FOR DUAL INLINE MEMORY MODULE COOL...
- Publication number 20240251528
- Publication date Jul 25, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Ernesto Ferrer Medina
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VARIABLE FLOW LIQUID-COOLED COOLING MODULE
- Publication number 20240107706
- Publication date Mar 28, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Harvey J. Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRESSURE REGULATOR ASSEMBLY FOR A COOLANT DISTRIBUTION UNIT
- Publication number 20240061453
- Publication date Feb 22, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Michael Scott
- G05 - CONTROLLING REGULATING
Information Patent Application
ELASTOMER EMBEDDED MULTIPOINT CONTACT COOLING
- Publication number 20240040748
- Publication date Feb 1, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Harvey J. Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORRUGATED THERMAL INTERFACE DEVICE WITH LATERAL SPRING FINGERS
- Publication number 20240027708
- Publication date Jan 25, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Harvey John LUNSMAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RECEPTACLE WITH CONNECTABLE SPRING FINGER FOR MULTIPOINT CONTACT CO...
- Publication number 20230345668
- Publication date Oct 26, 2023
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Harvey J. Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOL FLUID RESERVOIR FOR A COOLANT DISTRIBUTION UNIT
- Publication number 20230320031
- Publication date Oct 5, 2023
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Harvey J. Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACCUMULATOR FOR A COOLANT DISTRIBUTION UNIT
- Publication number 20230315133
- Publication date Oct 5, 2023
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Michael Scott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISCONNECTS
- Publication number 20230320032
- Publication date Oct 5, 2023
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- John Franz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ACCUMULATOR FOR A CHASSIS-LEVEL COOLING SYSTEM
- Publication number 20230262928
- Publication date Aug 17, 2023
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Steven Dean
- F15 - FLUID-PRESSURE ACTUATORS HYDRAULICS OR PNEUMATICS IN GENERAL
Information Patent Application
COOLING MODULE AND A METHOD OF COOLING AN ELECTRONIC CIRCUIT MODULE...
- Publication number 20230180429
- Publication date Jun 8, 2023
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Harvey J. Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING MODULE AND A METHOD OF ASSEMBLING THE COOLING MODULE TO AN...
- Publication number 20230180432
- Publication date Jun 8, 2023
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Harvey J. Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAK MITIGATION SYSTEM
- Publication number 20220404079
- Publication date Dec 22, 2022
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- John Franz
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
COOLING ASSEMBLY AND AN ELECTRONIC CIRCUIT MODULE HAVING THE SAME
- Publication number 20220344239
- Publication date Oct 27, 2022
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Harvey J. Lunsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTIGUOUS PLANE INFRASTRUCTURE FOR COMPUTING SYSTEMS
- Publication number 20220244762
- Publication date Aug 4, 2022
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Kevin B. Leigh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RECEPTACLE WITH CONNECTABLE SPRING FINGER FOR MULTIPOINT CONTACT CO...
- Publication number 20220240416
- Publication date Jul 28, 2022
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Harvey J. Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR EXTENDED SERIAL TEMPERATURE CONTROL IN A C...
- Publication number 20220201894
- Publication date Jun 23, 2022
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Tahir Cader
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MAGNETIC BLOCKS FOR THERMALLY COUPLING COOLING COMPONENT AND HEAT S...
- Publication number 20220122751
- Publication date Apr 21, 2022
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- John Franz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPOINT CONTACT CONDUCTION COOLING OF A REMOVABLE DEVICE
- Publication number 20220091642
- Publication date Mar 24, 2022
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Harvey J. Lunsman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONFORMING HEAT TRANSPORT DEVICE FOR DUAL INLINE MEMORY MODULE COOL...
- Publication number 20220053668
- Publication date Feb 17, 2022
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Ernesto Ferrer Medina
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PHOTO-ETCHED CHASSIS COOLING WALLS
- Publication number 20220039295
- Publication date Feb 3, 2022
- John Franz
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
DISCONNECTS
- Publication number 20210360824
- Publication date Nov 18, 2021
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- John FRANZ
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPUTE NODE TRAY COOLING
- Publication number 20210333846
- Publication date Oct 28, 2021
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Harvey J. Lunsman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LATCH ASSEMBLY FOR A MODULAR DEVICE
- Publication number 20210282282
- Publication date Sep 9, 2021
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Michael D. Scott
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...

Harvey John Lunsman

Person

Patents Grantslast 30 patents

System chassis with divider walls having a concave edge

Cooling module and a method of cooling an electronic circuit module...

Corrugated thermal interface device with lateral spring fingers

Conforming heat transport device for dual inline memory module cool...

Photo-etched chassis cooling walls

Contiguous plane infrastructure for computing systems

Cooling module and a method of assembling the cooling module to an...

Receptacle with connectable spring finger for multipoint contact co...

Disconnects

Leak mitigation system

Void free injection-molded cold plates

Multipoint contact conduction cooling of a removable device

Method and apparatus for extended serial temperature control in a c...

Magnetic blocks for thermally coupling cooling component and heat s...

Flexible I/O server interface card orientation

Latch assembly for a modular device

Leak mitigation in a cooling system for computing devices

Compute node tray cooling

Rack and row-scale cooling

Power supply dry disconnect liquid cooling

Valved connector

Pumps with pre-charged fluid

Leak mitigation system for a cooling system

Electrical and liquid cooling midplane

Cooling fluids in opposite directions across a device

Tunable cold plates

Chassis cooling

Cooling system for high-performance computer

Floating liquid cooled heat transfer solution

Dual in-line memory module (DIMM) Edgewater Spring (EWS) multi poin...

Patents Applicationslast 30 patents

LEVER ACTUATED COLD PLATE

COOLING MODULE AND A METHOD OF COOLING AN ELECTRONIC CIRCUIT MODULE...

ELASTOMER EMBEDDED MULTIPOINT CONTACT COOLING

CORRUGATED THERMAL INTERFACE DEVICE WITH LATERAL SPRING FINGERS

SYSTEM CHASSIS WITH DIVIDER WALLS HAVING A CONCAVE EDGE

FLUID COUPLINGS WITH MAGNETIC LATCH ASSEMBLY

CONFORMING HEAT TRANSPORT DEVICE FOR DUAL INLINE MEMORY MODULE COOL...

VARIABLE FLOW LIQUID-COOLED COOLING MODULE

PRESSURE REGULATOR ASSEMBLY FOR A COOLANT DISTRIBUTION UNIT

ELASTOMER EMBEDDED MULTIPOINT CONTACT COOLING

CORRUGATED THERMAL INTERFACE DEVICE WITH LATERAL SPRING FINGERS

RECEPTACLE WITH CONNECTABLE SPRING FINGER FOR MULTIPOINT CONTACT CO...

COOL FLUID RESERVOIR FOR A COOLANT DISTRIBUTION UNIT

ACCUMULATOR FOR A COOLANT DISTRIBUTION UNIT

DISCONNECTS

ACCUMULATOR FOR A CHASSIS-LEVEL COOLING SYSTEM

COOLING MODULE AND A METHOD OF COOLING AN ELECTRONIC CIRCUIT MODULE...

COOLING MODULE AND A METHOD OF ASSEMBLING THE COOLING MODULE TO AN...

LEAK MITIGATION SYSTEM

COOLING ASSEMBLY AND AN ELECTRONIC CIRCUIT MODULE HAVING THE SAME

CONTIGUOUS PLANE INFRASTRUCTURE FOR COMPUTING SYSTEMS

RECEPTACLE WITH CONNECTABLE SPRING FINGER FOR MULTIPOINT CONTACT CO...

METHOD AND APPARATUS FOR EXTENDED SERIAL TEMPERATURE CONTROL IN A C...

MAGNETIC BLOCKS FOR THERMALLY COUPLING COOLING COMPONENT AND HEAT S...

MULTIPOINT CONTACT CONDUCTION COOLING OF A REMOVABLE DEVICE

CONFORMING HEAT TRANSPORT DEVICE FOR DUAL INLINE MEMORY MODULE COOL...

PHOTO-ETCHED CHASSIS COOLING WALLS

DISCONNECTS

COMPUTE NODE TRAY COOLING

LATCH ASSEMBLY FOR A MODULAR DEVICE