Harvey N. Rogers

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Playa del Rey, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Wafer etching techniques
- Patent number 7,081,411
- Issue date Jul 25, 2006
- Northrop Grumman Corporation
- Raffi N Elmadjian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inexpensive wafer level MMIC chip packaging
- Patent number 6,888,253
- Issue date May 3, 2005
- Northrop Grumman Corporation
- Harvey Newell Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer thinning techniques
- Patent number 6,764,573
- Issue date Jul 20, 2004
- Northrop Grumman Corporation
- Richard Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer adhesive for semiconductor dry etch applications
- Patent number 6,551,905
- Issue date Apr 22, 2003
- TRW Inc.
- Michael E. Barsky
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wafer etching techniques
- Publication number 20050085091
- Publication date Apr 21, 2005
- Raffi Nazare Elmadjian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer thinning techniques
- Publication number 20030071009
- Publication date Apr 17, 2003
- Richard Lai
- H01 - BASIC ELECTRIC ELEMENTS