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Hasfiza Ramley
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Cheras, MY
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last 30 patents
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Patent Grant
Wire bonding on thinned portions of a lead-frame configured for use...
Patent number
7,259,460
Issue date
Aug 21, 2007
National Semiconductor Corporation
Jamie A. Bayan
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of fabricating a micro-array integrated circuit package
Patent number
7,186,588
Issue date
Mar 6, 2007
National Semiconductor Corporation
Jaime A. Bayan
H01 - BASIC ELECTRIC ELEMENTS