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Hau Nguyen
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San Jose, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Flip chip packaged devices with thermal pad
Patent number
11,955,456
Issue date
Apr 9, 2024
Texas Instruments Incorporated
Anindya Poddar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal ribs in electromechanical devices
Patent number
11,736,085
Issue date
Aug 22, 2023
Texas Instruments Incorporated
Anindya Poddar
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Bump bond structure for enhanced electromigration performance
Patent number
11,450,638
Issue date
Sep 20, 2022
Texas Instruments Incorporated
Dibyajat Mishra
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out electronic device
Patent number
11,410,875
Issue date
Aug 9, 2022
Texas Instruments Incorporated
Hau Thanh Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit backside metallization
Patent number
11,367,699
Issue date
Jun 21, 2022
Texas Instruments Incorporated
Hiroyuki Sada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stress buffer layer in embedded package
Patent number
11,183,441
Issue date
Nov 23, 2021
Texas Instruments Incorporated
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded die package multichip module
Patent number
11,158,595
Issue date
Oct 26, 2021
Texas Instruments Incorporated
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit backside metallization
Patent number
10,763,230
Issue date
Sep 1, 2020
Texas Instruments Incorporated
Hiroyuki Sada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bump bond structure for enhanced electromigration performance
Patent number
10,763,231
Issue date
Sep 1, 2020
Texas Instruments Incorporated
Dibyajat Mishra
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stress buffer layer in embedded package
Patent number
10,580,715
Issue date
Mar 3, 2020
Texas Instruments Incorporated
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor systems having dual leadframes
Patent number
10,573,582
Issue date
Feb 25, 2020
Texas Instruments Incorporated
Rajeev D. Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed repassivation for wafer chip scale packaging
Patent number
10,541,220
Issue date
Jan 21, 2020
Texas Instruments Incorporated
Daiki Komatsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor systems having premolded dual leadframes
Patent number
10,312,184
Issue date
Jun 4, 2019
Texas Instruments Incorporated
Rajeev D. Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Open cavity package using chip-embedding technology
Patent number
9,663,357
Issue date
May 30, 2017
Texas Instruments Incorporated
Jie Mao
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Foil-based method for packaging intergrated circuits
Patent number
8,389,334
Issue date
Mar 5, 2013
National Semiconductor Corporation
Aninyda Poddar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive paths for transmitting an electrical signal through an e...
Patent number
7,812,462
Issue date
Oct 12, 2010
National Semiconductor Corporation
Stephen Gee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and arrangements for forming solder joint connections
Patent number
7,755,200
Issue date
Jul 13, 2010
National Semiconductor Corporation
Hau Nguyen
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
High strength solder joint formation method for wafer level package...
Patent number
7,629,246
Issue date
Dec 8, 2009
National Semiconductor Corporation
Viraj Patwardhan
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method to dispense light blocking material for wafer level CSP
Patent number
7,510,908
Issue date
Mar 31, 2009
National Semiconductor Corporation
Hau Thanh Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit device package having a support coating for impr...
Patent number
7,423,337
Issue date
Sep 9, 2008
National Semiconductor Corporation
Viraj A. Patwardhan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for forming a pre-applied underfill adhesive layer for se...
Patent number
7,413,927
Issue date
Aug 19, 2008
National Semiconductor Corporation
Viraj A. Patwardhan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for forming a pre-applied underfill adhesive layer for se...
Patent number
7,301,222
Issue date
Nov 27, 2007
National Semiconductor Corporation
Viraj A. Patwardhan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for forming an underfill adhesive layer
Patent number
7,253,078
Issue date
Aug 7, 2007
National Semiconductor Corporation
Luu T. Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Techniques for attaching rotated photonic devices to an optical sub...
Patent number
6,973,225
Issue date
Dec 6, 2005
National Semiconductor Corporation
Luu Thanh Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PRE-PLATED LEAD TIP FOR WETTABLE FLANK LEADFRAME
Publication number
20240055327
Publication date
Feb 15, 2024
TEXAS INSTRUMENTS INCORPORATED
Makoto Yoshino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SMALL OUTLINE TRANSISTOR WITH THERMAL FLAT LEAD
Publication number
20240055331
Publication date
Feb 15, 2024
TEXAS INSTRUMENTS INCORPORATED
Hau Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL RIBS IN ELECTROMECHANICAL DEVICES
Publication number
20230396230
Publication date
Dec 7, 2023
TEXAS INSTRUMENTS INCORPORATED
Anindya PODDAR
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
ISOLATION PACKAGE WITH HIGH THERMAL CONDUCTIVITY
Publication number
20230317568
Publication date
Oct 5, 2023
TEXAS INSTRUMENTS INCORPORATED
Daiki Komatsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATION PROCESS FOR PROTECTING CIRCUIT COMPONENTS
Publication number
20230274993
Publication date
Aug 31, 2023
TEXAS INSTRUMENTS INCORPORATED
Anindya PODDAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD
Publication number
20230136784
Publication date
May 4, 2023
TEXAS INSTRUMENTS INCORPORATED
Anindya Poddar
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WAFER LEVEL PROCESSING FOR MICROELECTRONIC DEVICE PACKAGE WITH CAVITY
Publication number
20230092132
Publication date
Mar 23, 2023
TEXAS INSTRUMENTS INCORPORATED
Hau Nguyen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE
Publication number
20230005881
Publication date
Jan 5, 2023
TEXAS INSTRUMENTS INCORPORATED
Anindya Poddar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP CHIP PACKAGED DEVICES WITH THERMAL PAD
Publication number
20230005880
Publication date
Jan 5, 2023
TEXAS INSTRUMENTS INCORPORATED
Anindya Poddar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL RIBS IN ELECTROMECHANICAL DEVICES
Publication number
20220069795
Publication date
Mar 3, 2022
TEXAS INSTRUMENTS INCORPORATED
Anindya PODDAR
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
FRAME DESIGN IN EMBEDDED DIE PACKAGE
Publication number
20210134729
Publication date
May 6, 2021
TEXAS INSTRUMENTS INCORPORATED
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT BACKSIDE METALLIZATION
Publication number
20210035932
Publication date
Feb 4, 2021
TEXAS INSTRUMENTS INCORPORATED
Hiroyuki SADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE
Publication number
20200402938
Publication date
Dec 24, 2020
TEXAS INSTRUMENTS INCORPORATED
Dibyajat Mishra
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REPASSIVATION APPLICATION FOR WAFER-LEVEL CHIP-SCALE PACKAGE
Publication number
20200388508
Publication date
Dec 10, 2020
TEXAS INSTRUMENTS INCORPORATED
Makoto Shibuya
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Application
FAN-OUT ELECTRONIC DEVICE
Publication number
20200203219
Publication date
Jun 25, 2020
TEXAS INSTRUMENTS INCORPORATED
Hau Thanh Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stress Buffer Layer in Embedded Package
Publication number
20200203249
Publication date
Jun 25, 2020
TEXAS INSTRUMENTS INCORPORATED
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT BACKSIDE METALLIZATION
Publication number
20200203295
Publication date
Jun 25, 2020
TEXAS INSTRUMENTS INCORPORATED
Hiroyuki SADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED REPASSIVATION FOR WAFER CHIP SCALE PACKAGING
Publication number
20200043878
Publication date
Feb 6, 2020
TEXAS INSTRUMENTS INCORPORATED
Daiki Komatsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE
Publication number
20200035633
Publication date
Jan 30, 2020
TEXAS INSTRUMENTS INCORPORATED
Dibyajat Mishra
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stress Buffer Layer in Embedded Package
Publication number
20190385924
Publication date
Dec 19, 2019
TEXAS INSTRUMENTS INCORPORATED
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Systems Having Premolded Dual Leadframes
Publication number
20190237395
Publication date
Aug 1, 2019
TEXAS INSTRUMENTS INCORPORATED
Rajeev D. Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED DIE PACKAGE MULTICHIP MODULE
Publication number
20190013288
Publication date
Jan 10, 2019
WOOCHAN KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Systems Having Premolded Dual Leadframes
Publication number
20170125324
Publication date
May 4, 2017
TEXAS INSTRUMENTS INCORPORATED
Rajeev D. Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPEN CAVITY PACKAGE USING CHIP-EMBEDDING TECHNOLOGY
Publication number
20170015548
Publication date
Jan 19, 2017
TEXAS INSTRUMENTS INCORPORATED
Jie Mao
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
LOW PROFILE PACKAGE AND METHOD
Publication number
20120326300
Publication date
Dec 27, 2012
National Semiconductor Corporation
Tao FENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THIN FOIL SEMICONDUCTOR PACKAGE
Publication number
20120043660
Publication date
Feb 23, 2012
National Semiconductor Corporation
Anindya Poddar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE PATHS FOR TRANSMITTING AN ELECTRICAL SIGNAL THROUGH AN E...
Publication number
20100109167
Publication date
May 6, 2010
National Semiconductor Corporation
Stephen GEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND ARRANGEMENTS FOR FORMING SOLDER JOINT CONNECTIONS
Publication number
20100068466
Publication date
Mar 18, 2010
National Semiconductor Corporation
Hau NGUYEN
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
I/O PAD STRUCTURE FOR ENHANCING SOLDER JOINT RELIABILITY IN INTEGRA...
Publication number
20090174069
Publication date
Jul 9, 2009
National Semiconductor Corporation
Hau Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High strength solder joint formation method for wafer level package...
Publication number
20090057897
Publication date
Mar 5, 2009
National Semiconductor Corporation
Viraj Patwardhan
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR