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Hayato IGA

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  • Tokyo, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD FOR MANUFACTURING CHIPS
    • Publication number 20240342835
    • Publication date Oct 17, 2024
    • Disco Corporation
    • Hayato IGA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PROCESSING METHOD OF BONDED WAFER
    • Publication number 20240304448
    • Publication date Sep 12, 2024
    • Disco Corporation
    • Hayato TANAKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSING METHOD OF BONDED WAFER
    • Publication number 20240297052
    • Publication date Sep 5, 2024
    • Disco Corporation
    • Hayato TANAKA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING APPARATUS
    • Publication number 20240194501
    • Publication date Jun 13, 2024
    • Disco Corporation
    • Kentaro IIZUKA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CUTTING APPARATUS
    • Publication number 20240165842
    • Publication date May 23, 2024
    • Disco Corporation
    • Hayato IGA
    • B26 - HAND CUTTING TOOLS CUTTING SEVERING
  • Information Patent Application

    BONDED WAFER PROCESSING METHOD
    • Publication number 20240153776
    • Publication date May 9, 2024
    • Disco Corporation
    • Hayato IGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSING METHOD OF BONDED WAFER
    • Publication number 20240145248
    • Publication date May 2, 2024
    • Disco Corporation
    • Hayato IGA
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20240128087
    • Publication date Apr 18, 2024
    • Disco Corporation
    • Hayato IGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PROCESSING WAFER AND WAFER PROCESSING APPARATUS
    • Publication number 20240120215
    • Publication date Apr 11, 2024
    • Disco Corporation
    • Hayato IGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSING METHOD OF BONDED WAFER AND PROCESSING APPARATUS
    • Publication number 20240112902
    • Publication date Apr 4, 2024
    • Disco Corporation
    • Hayato IGA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INSPECTION METHOD OF WORKPIECE AND INSPECTION APPARATUS
    • Publication number 20240094143
    • Publication date Mar 21, 2024
    • Disco Corporation
    • Hayato IGA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PROCESSING METHOD OF BONDED WAFER AND PROCESSING APPARATUS
    • Publication number 20240087901
    • Publication date Mar 14, 2024
    • Disco Corporation
    • Kazuma SEKIYA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF MANUFACTURING WAFER
    • Publication number 20230415274
    • Publication date Dec 28, 2023
    • Disco Corporation
    • Hayato IGA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF MANUFACTURING MONOCRYSTALLINE SILICON SUBSTRATE
    • Publication number 20230390870
    • Publication date Dec 7, 2023
    • Disco Corporation
    • Hayato IGA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MANUFACTURING METHOD OF SINGLE CRYSTAL SILICON SUBSTRATE
    • Publication number 20230381894
    • Publication date Nov 30, 2023
    • Disco Corporation
    • Hayato IGA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MANUFACTURING METHOD OF SUBSTRATE
    • Publication number 20230364716
    • Publication date Nov 16, 2023
    • Disco Corporation
    • Hayato IGA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MANUFACTURING METHOD OF SINGLE-CRYSTAL SILICON SUBSTRATE
    • Publication number 20230234169
    • Publication date Jul 27, 2023
    • Disco Corporation
    • Hayato IGA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE MANUFACTURING METHOD
    • Publication number 20230219256
    • Publication date Jul 13, 2023
    • Disco Corporation
    • Yuki IKKU
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PROCESSING METHOD
    • Publication number 20230142363
    • Publication date May 11, 2023
    • Disco Corporation
    • Hayato IGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING SUBSTRATE
    • Publication number 20230137722
    • Publication date May 4, 2023
    • Disco Corporation
    • Hayato IGA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF MANUFACTURING MONOCRYSTALLINE SILICON SUBSTRATE
    • Publication number 20230119333
    • Publication date Apr 20, 2023
    • Disco Corporation
    • Hayato IGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBSTRATE MANUFACTURING METHOD
    • Publication number 20230112548
    • Publication date Apr 13, 2023
    • Disco Corporation
    • Hayato IGA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF PROCESSING MONOCRYSTALLINE SILICON WAFER
    • Publication number 20230066601
    • Publication date Mar 2, 2023
    • Disco Corporation
    • Hayato IGA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MANUFACTURING METHOD OF SINGLE-CRYSTAL SILICON SUBSTRATE
    • Publication number 20230054939
    • Publication date Feb 23, 2023
    • Disco Corporation
    • Hayato IGA
    • C30 - CRYSTAL GROWTH
  • Information Patent Application

    METHOD OF PROCESSING WAFER
    • Publication number 20230050807
    • Publication date Feb 16, 2023
    • Disco Corporation
    • Hayato IGA
    • H01 - BASIC ELECTRIC ELEMENTS