Hayato OKAMOTO

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device comprising a buffer layer including a complex...
- Patent number 11,799,022
- Issue date Oct 24, 2023
- Mitsubishi Electric Corporation
- Kakeru Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,444,156
- Issue date Sep 13, 2022
- Mitsubishi Electric Corporation
- Hayato Okamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230369477
- Publication date Nov 16, 2023
- Mitsubishi Electric Corporation
- Kakeru OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230299191
- Publication date Sep 21, 2023
- Mitsubishi Electric Corporation
- Yasuhiro YOSHIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230261056
- Publication date Aug 17, 2023
- Mitsubishi Electric Corporation
- Shigeto HONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20220115522
- Publication date Apr 14, 2022
- Mitsubishi Electric Corporation
- Kakeru OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210036107
- Publication date Feb 4, 2021
- Mitsubishi Electric Corporation
- Hayato OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS