Hayato TANAKA

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Tokyo, JP

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Patents Applicationslast 30 patents

Information Patent Application
WAFER PROCESSING METHOD AND CHAMFER REMOVING APPARATUS
- Publication number 20240399494
- Publication date Dec 5, 2024
- Disco Corporation
- Kazuya HIRATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CHIPS
- Publication number 20240342835
- Publication date Oct 17, 2024
- Disco Corporation
- Hayato IGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING METHOD OF BONDED WAFER
- Publication number 20240304448
- Publication date Sep 12, 2024
- Disco Corporation
- Hayato TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF BONDED WAFER
- Publication number 20240304457
- Publication date Sep 12, 2024
- Disco Corporation
- Hayato TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING METHOD OF BONDED WAFER
- Publication number 20240297052
- Publication date Sep 5, 2024
- Disco Corporation
- Hayato TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR