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Mie, JP
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Patents Grants
last 30 patents
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Patent Grant
Exposure method, exposure apparatus, and semiconductor device manuf...
Patent number
11,460,765
Issue date
Oct 4, 2022
Kioxia Corporation
Hayato Terai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate bonding apparatus
Patent number
11,267,237
Issue date
Mar 8, 2022
Kioxia Corporation
Hayato Terai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
EXPOSURE METHOD, EXPOSURE APPARATUS, AND SEMICONDUCTOR DEVICE MANUF...
Publication number
20210294205
Publication date
Sep 23, 2021
KIOXIA Corporation
Hayato TERAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE BONDING APPARATUS
Publication number
20210078317
Publication date
Mar 18, 2021
KIOXIA Corporation
Hayato TERAI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR