Hazel Deborah Schofield

Person

Tonbridge, GB

People

Patents Grantslast 30 patents

Information Patent Grant
Contact pad structure for flip chip semiconductor die
- Patent number 7,821,133
- Issue date Oct 26, 2010
- International Rectifier Corporation
- Hazel D. Schofield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages with substrates for redistributing se...
- Patent number 7,745,930
- Issue date Jun 29, 2010
- International Rectifier Corporation
- Norman Glyn Connah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale surface mounted device and process of manufacture
- Patent number 7,476,979
- Issue date Jan 13, 2009
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale surface mounted device and process of manufacture
- Patent number 7,253,090
- Issue date Aug 7, 2007
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale surface mounted device and process of manufacture
- Patent number 7,122,887
- Issue date Oct 17, 2006
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale surface mounted device and process of manufacture
- Patent number 6,890,845
- Issue date May 10, 2005
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive clip for a semiconductor package
- Patent number D503691
- Issue date Apr 5, 2005
- International Rectifier Corporation
- Martin Standing
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Chip scale surface mounted device and process of manufacture
- Patent number 6,767,820
- Issue date Jul 27, 2004
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale surface mounted device and process of manufacture
- Patent number 6,624,522
- Issue date Sep 23, 2003
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Contact pad structure for flip chip semiconductor die
- Publication number 20070096316
- Publication date May 3, 2007
- International Rectifier Corporation
- Hazel D. Schofield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device packages with substrates for redistributing se...
- Publication number 20060261473
- Publication date Nov 23, 2006
- International Rectifier Corporation
- Norman Glyn Connah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Chip scale surface mounted device and process of manufacture
- Publication number 20060220123
- Publication date Oct 5, 2006
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip scale surface mounted device and process of manufacture
- Publication number 20050186707
- Publication date Aug 25, 2005
- International Rectifier Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip scale surface mounted device and process of manufacture
- Publication number 20040224438
- Publication date Nov 11, 2004
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip scale surface mounted device and process of manufacture
- Publication number 20040038509
- Publication date Feb 26, 2004
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip scale surface mounted device and process of manufacture
- Publication number 20040026796
- Publication date Feb 12, 2004
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip scale surface mounted device and process of manufacture
- Publication number 20010048116
- Publication date Dec 6, 2001
- International Rectifier Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS

Hazel Deborah Schofield

Person

Patents Grantslast 30 patents

Contact pad structure for flip chip semiconductor die

Semiconductor device packages with substrates for redistributing se...

Chip scale surface mounted device and process of manufacture

Chip scale surface mounted device and process of manufacture

Chip scale surface mounted device and process of manufacture

Chip scale surface mounted device and process of manufacture

Conductive clip for a semiconductor package

Chip scale surface mounted device and process of manufacture

Chip scale surface mounted device and process of manufacture

Patents Applicationslast 30 patents

Contact pad structure for flip chip semiconductor die

Semiconductor device packages with substrates for redistributing se...

Chip scale surface mounted device and process of manufacture

Chip scale surface mounted device and process of manufacture

Chip scale surface mounted device and process of manufacture

Chip scale surface mounted device and process of manufacture

Chip scale surface mounted device and process of manufacture

Chip scale surface mounted device and process of manufacture