Hector Andrew Hamilton Steen

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Hemel Hempstead, GB

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Patents Grantslast 30 patents

Information Patent Grant
Soldering material based on Sn Ag and Cu
- Patent number 11,285,569
- Issue date Mar 29, 2022
- Henkel AG & Co. KGaA
- Hans-Jurgen Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering material based on Sn Ag and Cu
- Patent number 10,376,994
- Issue date Aug 13, 2019
- Hans-Jürgen Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloy powder paste use in PCB production
- Patent number 6,648,210
- Issue date Nov 18, 2003
- Multicore Solders Limited
- Hector Andrew Hamilton Steen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDERING MATERIAL BASED ON SN AG AND CU
- Publication number 20220168851
- Publication date Jun 2, 2022
- Henkel AG & Co. KGaA
- Hans-Jurgen Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING MATERIAL BASED ON SN AG AND CU
- Publication number 20200023472
- Publication date Jan 23, 2020
- Henkel AG & Co. KGaA
- Hans-Jurgen Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR