Hee Bong Lee

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Kyoungki-Do, KR

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Patents Grantslast 30 patents

Information Patent Grant
Bonding tool for mounting semiconductor chips
- Patent number 7,958,628
- Issue date Jun 14, 2011
- STATS ChipPAC, Ltd.
- Hee-Bong Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding tool for mounting semiconductor chips
- Patent number 7,650,688
- Issue date Jan 26, 2010
- ChipPAC, Inc.
- Hee-Bong Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip packaging method with individually placed film a...
- Patent number 7,306,971
- Issue date Dec 11, 2007
- Chippac Inc.
- Jin-Wook Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for peeling semiconductor chips from tape
- Patent number 7,238,258
- Issue date Jul 3, 2007
- Stats Chippac Ltd.
- Soo-San Park
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Bonding Tool for Mounting Semiconductor Chips
- Publication number 20100083494
- Publication date Apr 8, 2010
- ChipPAC, Inc.
- Hee-Bong Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED DIE PACKAGING SYSTEM
- Publication number 20070085184
- Publication date Apr 19, 2007
- STATS ChipPAC Ltd.
- Hyeog Chan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding tool for mounting semiconductor chips
- Publication number 20050221582
- Publication date Oct 6, 2005
- ChipPAC, Inc.
- Hee-Bong Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor chip packaging method with individually placed film a...
- Publication number 20050208701
- Publication date Sep 22, 2005
- ChipPAC, Inc.
- Jin-Wook Jeong
- H01 - BASIC ELECTRIC ELEMENTS