Hee-Joong Oh

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Hwaseong-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including wire bonding pads and pad layout method
- Patent number 7,476,983
- Issue date Jan 13, 2009
- Samsung Electronics Co., Ltd.
- Na-Rae Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Pad structure, pad layout structure, and pad layout method in semic...
- Publication number 20060255477
- Publication date Nov 16, 2006
- Samsung Electronics Co. Ltd.
- Na-Rae Kim
- H01 - BASIC ELECTRIC ELEMENTS