Hee Sun CHUN

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Dielectric composition and multilayer capacitor comprising the same
- Patent number 12,125,641
- Issue date Oct 22, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hui Sun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,101,880
- Issue date Sep 24, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hee-Joon Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer capacitor
- Patent number 12,009,152
- Issue date Jun 11, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hong Gi Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component including side margin portion havin...
- Patent number 11,915,880
- Issue date Feb 27, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hee Sun Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component
- Patent number 11,894,192
- Issue date Feb 6, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung In Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component
- Patent number 11,830,678
- Issue date Nov 28, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ji Su Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component
- Patent number 11,791,103
- Issue date Oct 17, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyeg Soon An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 11,715,596
- Issue date Aug 1, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Sung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor
- Patent number 11,657,971
- Issue date May 23, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hong Gi Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric composition and multilayer electronic component includin...
- Patent number 11,636,979
- Issue date Apr 25, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hee Sun Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 11,315,729
- Issue date Apr 26, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Sung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric ceramic composition and multilayer ceramic capacitor com...
- Patent number 11,295,894
- Issue date Apr 5, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hee Sun Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 10,849,226
- Issue date Nov 24, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi-Sun Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 10,779,409
- Issue date Sep 15, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Byung-Duk Na
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulating film and producing method for insulating film
- Patent number 9,318,234
- Issue date Apr 19, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chung Hee Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste composition for external electrode and multilayer...
- Patent number 9,202,624
- Issue date Dec 1, 2015
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Choon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed circuit board including flame reta...
- Patent number 8,840,967
- Issue date Sep 23, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jae-Choon Cho
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20240203649
- Publication date Jun 20, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Hee Sun Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CAPACITOR
- Publication number 20230253153
- Publication date Aug 10, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Hong Gi NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC COMPOSITION AND MULTILAYER CAPACITOR COMPRISING THE SAME
- Publication number 20230119343
- Publication date Apr 20, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Hui Sun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220408559
- Publication date Dec 22, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Hee-Joon CHUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20220270822
- Publication date Aug 25, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Seung In Baik
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20220270824
- Publication date Aug 25, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Hyeg Soon AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20220230809
- Publication date Jul 21, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Hee Sun CHUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC ELECTRONIC COMPONENT
- Publication number 20220230810
- Publication date Jul 21, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Ji Su Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20220223343
- Publication date Jul 14, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Jae Sung PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CAPACITOR
- Publication number 20220208455
- Publication date Jun 30, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Hong Gi NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC MATERIAL AND MULTILAYER CERAMIC ELECTRONIC COMPONENT INC...
- Publication number 20220204407
- Publication date Jun 30, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Sung PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC COMPOSITION AND MULTILAYER ELECTRONIC COMPONENT INCLUDIN...
- Publication number 20220181080
- Publication date Jun 9, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Hee Sun CHUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20210142945
- Publication date May 13, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Jae Sung PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR COM...
- Publication number 20200395173
- Publication date Dec 17, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Hee Sun CHUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200178392
- Publication date Jun 4, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Mi-Sun HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20200154568
- Publication date May 14, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Byung-Duk NA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laminate for Printed Circuit Board and Printed Circuit Board Using...
- Publication number 20150056472
- Publication date Feb 26, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Chung Hee LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATING FILM AND PRODUCING METHOD FOR INSULATING FILM
- Publication number 20140065413
- Publication date Mar 6, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Chung Hee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MEASURING DRYING RATE AND METHOD FOR MEASURING DRYING...
- Publication number 20140041445
- Publication date Feb 13, 2014
- Hee Sun Chun
- G01 - MEASURING TESTING
Information Patent Application
INSULATOR FOR BUILD-UP PCB AND METHOD OF MANUFACTURING PCB USING TH...
- Publication number 20140037889
- Publication date Feb 6, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jong-Yoon JANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATION FILM HAVING METAL LAYER
- Publication number 20140017487
- Publication date Jan 16, 2014
- Hee Sun Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EPOXY RESIN COMPOSITION FOR BUILD-UP INSULATING FILM, INSULATING FI...
- Publication number 20140014402
- Publication date Jan 16, 2014
- Jae Choon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PASTE COMPOSITION FOR EXTERNAL ELECTRODE AND MULTILAYER...
- Publication number 20130329336
- Publication date Dec 12, 2013
- Jae Choon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD INCLUDING FLAME RETA...
- Publication number 20120064231
- Publication date Mar 15, 2012
- Jae-Choon Cho
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Hee Sun CHUN

Person

Patents Grantslast 30 patents

Dielectric composition and multilayer capacitor comprising the same

Printed circuit board

Multilayer capacitor

Multilayer electronic component including side margin portion havin...

Multilayer ceramic electronic component

Ceramic electronic component

Multilayer ceramic electronic component

Multilayer ceramic capacitor

Multilayer capacitor

Dielectric composition and multilayer electronic component includin...

Multilayer ceramic capacitor

Dielectric ceramic composition and multilayer ceramic capacitor com...

Printed circuit board and method of manufacturing the same

Printed circuit board

Insulating film and producing method for insulating film

Conductive paste composition for external electrode and multilayer...

Method for manufacturing printed circuit board including flame reta...

Patents Applicationslast 30 patents

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER CAPACITOR

DIELECTRIC COMPOSITION AND MULTILAYER CAPACITOR COMPRISING THE SAME

PRINTED CIRCUIT BOARD

MULTILAYER CERAMIC ELECTRONIC COMPONENT

MULTILAYER CERAMIC ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

CERAMIC ELECTRONIC COMPONENT

MULTILAYER CERAMIC CAPACITOR

MULTILAYER CAPACITOR

DIELECTRIC MATERIAL AND MULTILAYER CERAMIC ELECTRONIC COMPONENT INC...

DIELECTRIC COMPOSITION AND MULTILAYER ELECTRONIC COMPONENT INCLUDIN...

MULTILAYER CERAMIC CAPACITOR

DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR COM...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD

Laminate for Printed Circuit Board and Printed Circuit Board Using...

INSULATING FILM AND PRODUCING METHOD FOR INSULATING FILM

APPARATUS FOR MEASURING DRYING RATE AND METHOD FOR MEASURING DRYING...

INSULATOR FOR BUILD-UP PCB AND METHOD OF MANUFACTURING PCB USING TH...

INSULATION FILM HAVING METAL LAYER

EPOXY RESIN COMPOSITION FOR BUILD-UP INSULATING FILM, INSULATING FI...

CONDUCTIVE PASTE COMPOSITION FOR EXTERNAL ELECTRODE AND MULTILAYER...

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD INCLUDING FLAME RETA...