Hee-Yong Shim

Person

Daejeon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Thermosetting resin composition for semiconductor package, prepreg...
- Patent number 12,129,338
- Issue date Oct 29, 2024
- LG Chem, Ltd.
- Changbo Shim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermosetting resin composite and metal clad laminate using the same
- Patent number 12,091,510
- Issue date Sep 17, 2024
- LG Chem, Ltd.
- Changbo Shim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermosetting resin composition for semiconductor package and prepr...
- Patent number 11,535,750
- Issue date Dec 27, 2022
- LG Chem, Ltd.
- Hwa Yeon Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting resin composition for coating metal thin film and met...
- Patent number 11,459,449
- Issue date Oct 4, 2022
- LG Chem, Ltd.
- Minhyuk Yun
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Resin composition for semiconductor package, prepreg and metal clad...
- Patent number 11,214,677
- Issue date Jan 4, 2022
- LG Chem, Ltd.
- Chang Bo Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting resin composition for semiconductor package and prepr...
- Patent number 11,193,015
- Issue date Dec 7, 2021
- LG Chem, Ltd.
- Hwayeon Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition for semiconductor package, prepreg, and metal cla...
- Patent number 11,091,630
- Issue date Aug 17, 2021
- LG Chem, Ltd.
- Chang Bo Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting resin composition for semiconductor package and prepr...
- Patent number 10,294,341
- Issue date May 21, 2019
- LG Chem, Ltd.
- Hwa Yeon Moon
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition and prepreg and metal clad laminate...
- Patent number 9,278,505
- Issue date Mar 8, 2016
- LG Chem, Ltd.
- Hee-Yong Shim
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
THERMOSETTING RESIN COMPOSITE AND METAL CLAD LAMINATE USING THE SAME
- Publication number 20200339740
- Publication date Oct 29, 2020
- LG CHEM, LTD.
- Changbo SHIM
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, PREPREG...
- Publication number 20200332056
- Publication date Oct 22, 2020
- LG CHEM, LTD.
- Changbo SHIM
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, AND PREPREG AND METAL...
- Publication number 20200231804
- Publication date Jul 23, 2020
- LG CHEM, LTD.
- Chang Bo SHIM
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE AND PREPR...
- Publication number 20200190313
- Publication date Jun 18, 2020
- LG CHEM, LTD.
- Hwayeon MOON
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING RESIN COMPOSITION FOR COATING METAL THIN FILM AND MET...
- Publication number 20200048440
- Publication date Feb 13, 2020
- LG CHEM, LTD.
- Minhyuk YUN
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, PREPREG AND METAL CLAD...
- Publication number 20190276661
- Publication date Sep 12, 2019
- LG CHEM, LTD.
- Chang Bo SHIM
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, PREPREG, AND METAL CLA...
- Publication number 20190270881
- Publication date Sep 5, 2019
- LG CHEM, LTD.
- Chang Bo SHIM
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermosetting resin composition for semiconductor package and prepr...
- Publication number 20180148555
- Publication date May 31, 2018
- LG CHEM, LTD.
- Hwa Yeon MOON
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE AND PREPR...
- Publication number 20160369099
- Publication date Dec 22, 2016
- LG CHEM, LTD.
- Hwa Yeon MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND PREPREG AND METAL CLAD LAMINATE...
- Publication number 20130319609
- Publication date Dec 5, 2013
- LG CHEM, LTD.
- Hee-Yong Shim
- B32 - LAYERED PRODUCTS

Hee-Yong Shim

Person

Patents Grantslast 30 patents

Thermosetting resin composition for semiconductor package, prepreg...

Thermosetting resin composite and metal clad laminate using the same

Thermosetting resin composition for semiconductor package and prepr...

Thermosetting resin composition for coating metal thin film and met...

Resin composition for semiconductor package, prepreg and metal clad...

Thermosetting resin composition for semiconductor package and prepr...

Resin composition for semiconductor package, prepreg, and metal cla...

Thermosetting resin composition for semiconductor package and prepr...

Thermosetting resin composition and prepreg and metal clad laminate...

Patents Applicationslast 30 patents

THERMOSETTING RESIN COMPOSITE AND METAL CLAD LAMINATE USING THE SAME

THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, PREPREG...

RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, AND PREPREG AND METAL...

THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE AND PREPR...

THERMOSETTING RESIN COMPOSITION FOR COATING METAL THIN FILM AND MET...

RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, PREPREG AND METAL CLAD...

RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, PREPREG, AND METAL CLA...

Thermosetting resin composition for semiconductor package and prepr...

THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE AND PREPR...

THERMOSETTING RESIN COMPOSITION AND PREPREG AND METAL CLAD LAMINATE...