Heejung Hwang

Person

Suwon-si, Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including a thermal pillar and heat transfer...
- Patent number 11,502,059
- Issue date Nov 15, 2022
- Samsung Electronics Co., Ltd.
- Heejung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including heat spreader and method for manufa...
- Patent number 9,653,373
- Issue date May 16, 2017
- Samsung Electronics Co., Ltd.
- Jae Choon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of controlling temperature thereof
- Patent number 8,692,349
- Issue date Apr 8, 2014
- Samsung Electronics Co., Ltd.
- Jae Choon Kim
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118620
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Young-Deuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250062257
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Young-Deuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20240355770
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- YOUNG-DEUK KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240304564
- Publication date Sep 12, 2024
- Samsung Electronics Co., Ltd.
- Junbae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234388
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Mina Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240136340
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Mina Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240079393
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Youngdeuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240014166
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Youngdeuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A THERMAL PILLAR AND HEAT TRANSFER...
- Publication number 20200335480
- Publication date Oct 22, 2020
- Samsung Electronics Co., Ltd.
- HEEJUNG HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER AND METHOD FOR MANUFA...
- Publication number 20160300774
- Publication date Oct 13, 2016
- Jae Choon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140327129
- Publication date Nov 6, 2014
- Eunseok CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF CONTROLLING TEMPERATURE THEREOF
- Publication number 20140184312
- Publication date Jul 3, 2014
- Samsung Electronics Co., Ltd.
- Jae Choon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices And Methods Of Controlling Temperature Thereof
- Publication number 20120133427
- Publication date May 31, 2012
- Samsung Electronics Co., Ltd.
- Jae Choon Kim
- G05 - CONTROLLING REGULATING

Heejung Hwang

Person

Patents Grantslast 30 patents

Semiconductor package including a thermal pillar and heat transfer...

Semiconductor package including heat spreader and method for manufa...

Semiconductor devices and methods of controlling temperature thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING A THERMAL PILLAR AND HEAT TRANSFER...

SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER AND METHOD FOR MANUFA...

PACKAGE ON PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF CONTROLLING TEMPERATURE THEREOF

Semiconductor Devices And Methods Of Controlling Temperature Thereof