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Patents Grants
last 30 patents
Information
Patent Grant
Selective EMI shielding using preformed mask
Patent number
11,990,424
Issue date
May 21, 2024
STATS ChipPAC Pte. Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cooling device and process for cooling double-sided SiP devices dur...
Patent number
11,932,933
Issue date
Mar 19, 2024
STATS ChipPAC Pte. Ltd.
OhHan Kim
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
Patent number
11,842,991
Issue date
Dec 12, 2023
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of providing high density component...
Patent number
11,769,730
Issue date
Sep 26, 2023
STATS ChipPAC Pte. Ltd.
WoonJae Beak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and device for reducing metal burrs when sawing semiconducto...
Patent number
11,676,911
Issue date
Jun 13, 2023
STATS ChipPAC Pte. Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System-in-package with double-sided molding
Patent number
11,670,618
Issue date
Jun 6, 2023
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective EMI shielding using preformed mask
Patent number
11,664,327
Issue date
May 30, 2023
STATS ChipPAC Pte. Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of embedding circuit pattern in enc...
Patent number
11,652,065
Issue date
May 16, 2023
STATS ChipPAC Pte. Ltd.
JinHee Jung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming embedded die substrate,...
Patent number
11,652,088
Issue date
May 16, 2023
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded laser package with electromagnetic interference shield and m...
Patent number
11,587,882
Issue date
Feb 21, 2023
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cooling device and process for cooling double-sided SiP devices dur...
Patent number
11,434,561
Issue date
Sep 6, 2022
STATS ChipPAC Pte. Ltd.
OhHan Kim
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Semiconductor device and method of forming an integrated SiP module...
Patent number
11,367,690
Issue date
Jun 21, 2022
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming protrusion e-bar for 3D SiP
Patent number
11,342,294
Issue date
May 24, 2022
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and device for reducing metal burrs when sawing semiconducto...
Patent number
11,244,908
Issue date
Feb 8, 2022
STATS ChipPAC Pte. Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming embedded die substrate,...
Patent number
11,189,598
Issue date
Nov 30, 2021
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded laser package with electromagnetic interference shield and m...
Patent number
10,937,741
Issue date
Mar 2, 2021
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System-in-package with double-sided molding
Patent number
10,797,024
Issue date
Oct 6, 2020
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
Patent number
10,797,039
Issue date
Oct 6, 2020
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming a 3D integrated system-i...
Patent number
10,790,268
Issue date
Sep 29, 2020
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming an integrated SIP module...
Patent number
10,700,011
Issue date
Jun 30, 2020
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming protrusion E-bar for 3D SIP
Patent number
10,636,756
Issue date
Apr 28, 2020
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming a 3D integrated system-i...
Patent number
10,636,774
Issue date
Apr 28, 2020
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System-in-package with double-sided molding
Patent number
10,636,765
Issue date
Apr 28, 2020
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming embedded die substrate,...
Patent number
10,468,384
Issue date
Nov 5, 2019
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with interposer support structu...
Patent number
9,859,200
Issue date
Jan 2, 2018
STATS ChipPAC Pte. Ltd.
SooSan Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with plated copper posts and me...
Patent number
9,693,455
Issue date
Jun 27, 2017
STATS ChipPAC Pte. Ltd.
Seong Won Park
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated circuit packaging system with coreless substrate and met...
Patent number
9,673,171
Issue date
Jun 6, 2017
STATS ChipPAC Pte. Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with surface treatment and meth...
Patent number
9,385,100
Issue date
Jul 5, 2016
STATS ChipPAC Pte. Ltd.
Hun Teak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with coreless substrate and met...
Patent number
9,171,739
Issue date
Oct 27, 2015
Stats Chippac Ltd.
YoungDal Roh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with heat spreader and method o...
Patent number
9,093,415
Issue date
Jul 28, 2015
Stats Chippac Ltd.
Oh Han Kim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME
Publication number
20240120289
Publication date
Apr 11, 2024
JCET STATS ChipPAC Korea Limited
SeungHyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING A SHIELDING LAYER ON A SEMICONDUCTOR DEVICE
Publication number
20240120268
Publication date
Apr 11, 2024
JCET STATS ChipPAC Korea Limited
SeungHyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
Publication number
20240112981
Publication date
Apr 4, 2024
STATS ChipPAC Pte Ltd.
ChangOh KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Graphene-Coated Core Emb...
Publication number
20240096736
Publication date
Mar 21, 2024
STATS ChipPAC Pte Ltd.
YongMoo Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Antenna-In-Package Structure
Publication number
20240096770
Publication date
Mar 21, 2024
JCET STATS ChipPAC Korea Limited
SeungHyun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND METHOD FOR MAKING THE SAME
Publication number
20240057249
Publication date
Feb 15, 2024
JCET STATS ChipPAC Korea Limited
SeungHyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Conductive Structure for...
Publication number
20240030154
Publication date
Jan 25, 2024
JCET STATS ChipPAC Korea Limited
SeungHyun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Heat Dissipation Using Graphene
Publication number
20240014093
Publication date
Jan 11, 2024
STATS ChipPAC Pte Ltd.
ChangOh Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PARTIALLY SHIEDED SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
Publication number
20230402400
Publication date
Dec 14, 2023
STATS ChipPAC Pte Ltd.
HunTeak LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method for Advanced Thermal Dissipation
Publication number
20230402343
Publication date
Dec 14, 2023
STATS ChipPAC Pte Ltd.
SeungHyun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Providing High Density Component...
Publication number
20230402383
Publication date
Dec 14, 2023
STATS ChipPAC Pte Ltd.
WoonJae Beak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Disposing Electrical Components...
Publication number
20230395477
Publication date
Dec 7, 2023
STATS ChipPAC Pte Ltd.
GunHyuck Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Selective EMI Shielding Using Preformed Mask
Publication number
20230275034
Publication date
Aug 31, 2023
STATS ChipPAC Pte Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and Device for Reducing Metal Burrs When Sawing Semiconducto...
Publication number
20230268289
Publication date
Aug 24, 2023
STATS ChipPAC Pte Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Molded Laser Package with Electromagnetic Interference Shield and M...
Publication number
20230154864
Publication date
May 18, 2023
STATS ChipPAC Pte Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Making a Photonic Semiconductor...
Publication number
20230125546
Publication date
Apr 27, 2023
STATS ChipPAC Pte Ltd.
KyungOe Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Cooling Device and Process for Cooling Double-Sided SiP Devices Dur...
Publication number
20220364222
Publication date
Nov 17, 2022
STATS ChipPAC Pte Ltd.
OhHan Kim
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Semiconductor Device and Method of Embedding Circuit Pattern in Enc...
Publication number
20220359418
Publication date
Nov 10, 2022
STATS ChipPAC Pte Ltd.
JinHee Jung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Selective EMI Shielding Using Preformed Mask
Publication number
20220157739
Publication date
May 19, 2022
STATS ChipPAC Pte Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and Device for Reducing Metal Burrs When Sawing Semiconducto...
Publication number
20220115332
Publication date
Apr 14, 2022
STATS ChipPAC Pte Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Embedded Die Substrate,...
Publication number
20220052025
Publication date
Feb 17, 2022
STATS ChipPAC Pte Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Providing High Density Component...
Publication number
20210305168
Publication date
Sep 30, 2021
STATS ChipPAC Pte Ltd.
WoonJae Beak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Cooling Device and Process for Cooling Double-Sided SiP Devices Dur...
Publication number
20210301390
Publication date
Sep 30, 2021
STATS ChipPAC Pte Ltd.
OhHan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Molded Laser Package with Electromagnetic Interference Shield and M...
Publication number
20210151386
Publication date
May 20, 2021
STATS ChipPAC Pte Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
System-in-Package with Double-Sided Molding
Publication number
20200402955
Publication date
Dec 24, 2020
STATS ChipPAC Pte Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming a 3D Interposer System-i...
Publication number
20200373289
Publication date
Nov 26, 2020
STATS ChipPAC Pte Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming an Integrated SIP Module...
Publication number
20200286835
Publication date
Sep 10, 2020
STATS ChipPAC Pte Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP
Publication number
20200219835
Publication date
Jul 9, 2020
STATS ChipPAC Pte Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming a 3D Integrated System-i...
Publication number
20200219859
Publication date
Jul 9, 2020
STATS ChipPAC Pte Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
System-in-Package with Double-Sided Molding
Publication number
20200219847
Publication date
Jul 9, 2020
STATS ChipPAC Pte Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS