HeeSoo Lee

Person

Anyang-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for advanced thermal dissipation
- Patent number 12,266,587
- Issue date Apr 1, 2025
- STATS ChipPAC Pte. Ltd.
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded laser package with electromagnetic interference shield and m...
- Patent number 12,266,614
- Issue date Apr 1, 2025
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a photonic semiconductor...
- Patent number 12,218,114
- Issue date Feb 4, 2025
- STATS ChipPAC Pte. Ltd.
- KyungOe Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated antenna-in-package structure
- Patent number 12,211,773
- Issue date Jan 28, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for reducing metal burrs when sawing semiconducto...
- Patent number 12,046,564
- Issue date Jul 23, 2024
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective EMI shielding using preformed mask
- Patent number 11,990,424
- Issue date May 21, 2024
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device and process for cooling double-sided SiP devices dur...
- Patent number 11,932,933
- Issue date Mar 19, 2024
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 11,842,991
- Issue date Dec 12, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of providing high density component...
- Patent number 11,769,730
- Issue date Sep 26, 2023
- STATS ChipPAC Pte. Ltd.
- WoonJae Beak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for reducing metal burrs when sawing semiconducto...
- Patent number 11,676,911
- Issue date Jun 13, 2023
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with double-sided molding
- Patent number 11,670,618
- Issue date Jun 6, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective EMI shielding using preformed mask
- Patent number 11,664,327
- Issue date May 30, 2023
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of embedding circuit pattern in enc...
- Patent number 11,652,065
- Issue date May 16, 2023
- STATS ChipPAC Pte. Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded die substrate,...
- Patent number 11,652,088
- Issue date May 16, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded laser package with electromagnetic interference shield and m...
- Patent number 11,587,882
- Issue date Feb 21, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device and process for cooling double-sided SiP devices dur...
- Patent number 11,434,561
- Issue date Sep 6, 2022
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of forming an integrated SiP module...
- Patent number 11,367,690
- Issue date Jun 21, 2022
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming protrusion e-bar for 3D SiP
- Patent number 11,342,294
- Issue date May 24, 2022
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for reducing metal burrs when sawing semiconducto...
- Patent number 11,244,908
- Issue date Feb 8, 2022
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded die substrate,...
- Patent number 11,189,598
- Issue date Nov 30, 2021
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded laser package with electromagnetic interference shield and m...
- Patent number 10,937,741
- Issue date Mar 2, 2021
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with double-sided molding
- Patent number 10,797,024
- Issue date Oct 6, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 10,797,039
- Issue date Oct 6, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D integrated system-i...
- Patent number 10,790,268
- Issue date Sep 29, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an integrated SIP module...
- Patent number 10,700,011
- Issue date Jun 30, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming protrusion E-bar for 3D SIP
- Patent number 10,636,756
- Issue date Apr 28, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D integrated system-i...
- Patent number 10,636,774
- Issue date Apr 28, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with double-sided molding
- Patent number 10,636,765
- Issue date Apr 28, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded die substrate,...
- Patent number 10,468,384
- Issue date Nov 5, 2019
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interposer support structu...
- Patent number 9,859,200
- Issue date Jan 2, 2018
- STATS ChipPAC Pte. Ltd.
- SooSan Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND A METHOD FOR FORMING THE SAME
- Publication number 20250239531
- Publication date Jul 24, 2025
- STATS ChipPAC Pte Ltd.
- TaeWoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking and Interconnecting Sem...
- Publication number 20250226345
- Publication date Jul 10, 2025
- STATS ChipPAC Pte Ltd.
- YongMoo SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Laser Package with Electromagnetic Interference Shield and M...
- Publication number 20250201730
- Publication date Jun 19, 2025
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Advanced Thermal Dissipation
- Publication number 20250201655
- Publication date Jun 19, 2025
- STATS ChipPAC Pte Ltd.
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH INTEGRATED ANTENNAS AND A METHOD FOR FORMIN...
- Publication number 20250167168
- Publication date May 22, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE ASSEMBLY AND A METHOD FOR FORMING THE SAME
- Publication number 20250140773
- Publication date May 1, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE ASSEMBLY AND METHODS FOR FORMING THE SAME
- Publication number 20250140679
- Publication date May 1, 2025
- JCET STATS ChipPAC Korea Limited
- SangHoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Antenna-In-Package Structure
- Publication number 20250125233
- Publication date Apr 17, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Trace Substrate...
- Publication number 20250118599
- Publication date Apr 10, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Fine-Pitch Interconnecti...
- Publication number 20250105162
- Publication date Mar 27, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making Face-Up Wafer-Level Packa...
- Publication number 20250079380
- Publication date Mar 6, 2025
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming AIP Structure to Reduce...
- Publication number 20250079350
- Publication date Mar 6, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Antenna-in-Package St...
- Publication number 20250038058
- Publication date Jan 30, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING AN ELECTRONIC DEVICE ON A FLEXIBLE SUBSTRATE AN...
- Publication number 20250031317
- Publication date Jan 23, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Making Redistribution Layers wit...
- Publication number 20250022792
- Publication date Jan 16, 2025
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240421015
- Publication date Dec 19, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making an EMI Shield Using Inten...
- Publication number 20240413095
- Publication date Dec 12, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED HEAT DISSIPATION
- Publication number 20240404911
- Publication date Dec 5, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME
- Publication number 20240405049
- Publication date Dec 5, 2024
- STATS ChipPAC Pte Ltd.
- BumRyul MAENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Multi-Tier System-in-Pa...
- Publication number 20240371759
- Publication date Nov 7, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20240371825
- Publication date Nov 7, 2024
- STATS ChipPAC Pte Ltd.
- TaeWoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION AND METHOD FOR...
- Publication number 20240332114
- Publication date Oct 3, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interconnect Structure w...
- Publication number 20240332035
- Publication date Oct 3, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Partial Shielding with Embedded...
- Publication number 20240321768
- Publication date Sep 26, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Antenna-in-Package St...
- Publication number 20240321664
- Publication date Sep 26, 2024
- JCET STATS ChipPAC Korea Limited
- YeJin PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a 3-D Stacked Semiconduc...
- Publication number 20240321783
- Publication date Sep 26, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Compartment Shielding fo...
- Publication number 20240321845
- Publication date Sep 26, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Fine Pitch Conductive Po...
- Publication number 20240312884
- Publication date Sep 19, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240250062
- Publication date Jul 25, 2024
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
- Publication number 20240234292
- Publication date Jul 11, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device and method for advanced thermal dissipation

Molded laser package with electromagnetic interference shield and m...

Semiconductor device and method of making a photonic semiconductor...

Integrated antenna-in-package structure

Method and device for reducing metal burrs when sawing semiconducto...

Selective EMI shielding using preformed mask

Cooling device and process for cooling double-sided SiP devices dur...

Semiconductor device and method of forming a 3D interposer system-i...

Semiconductor device and method of providing high density component...

Method and device for reducing metal burrs when sawing semiconducto...

System-in-package with double-sided molding

Selective EMI shielding using preformed mask

Semiconductor device and method of embedding circuit pattern in enc...

Semiconductor device and method of forming embedded die substrate,...

Molded laser package with electromagnetic interference shield and m...

Cooling device and process for cooling double-sided SiP devices dur...

Semiconductor device and method of forming an integrated SiP module...

Semiconductor device and method of forming protrusion e-bar for 3D SiP

Method and device for reducing metal burrs when sawing semiconducto...

Semiconductor device and method of forming embedded die substrate,...

Molded laser package with electromagnetic interference shield and m...

System-in-package with double-sided molding

Semiconductor device and method of forming a 3D interposer system-i...

Semiconductor device and method of forming a 3D integrated system-i...

Semiconductor device and method of forming an integrated SIP module...

Semiconductor device and method of forming protrusion E-bar for 3D SIP

Semiconductor device and method of forming a 3D integrated system-i...

System-in-package with double-sided molding

Semiconductor device and method of forming embedded die substrate,...

Integrated circuit packaging system with interposer support structu...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND A METHOD FOR FORMING THE SAME

Semiconductor Device and Method of Stacking and Interconnecting Sem...

Molded Laser Package with Electromagnetic Interference Shield and M...

Semiconductor Device and Method for Advanced Thermal Dissipation

ELECTRONIC PACKAGE WITH INTEGRATED ANTENNAS AND A METHOD FOR FORMIN...

ELECTRONIC PACKAGE ASSEMBLY AND A METHOD FOR FORMING THE SAME

ELECTRONIC PACKAGE ASSEMBLY AND METHODS FOR FORMING THE SAME

Integrated Antenna-In-Package Structure

Semiconductor Device and Method of Forming Embedded Trace Substrate...

Semiconductor Device and Method of Forming Fine-Pitch Interconnecti...

Semiconductor Device and Method of Making Face-Up Wafer-Level Packa...

Semiconductor Device and Method of Forming AIP Structure to Reduce...

Semiconductor Device and Method of Forming an Antenna-in-Package St...

METHOD FOR MOUNTING AN ELECTRONIC DEVICE ON A FLEXIBLE SUBSTRATE AN...

Semiconductor Device and Method of Making Redistribution Layers wit...

SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

Semiconductor Device and Method of Making an EMI Shield Using Inten...

SEMICONDUCTOR PACKAGE WITH IMPROVED HEAT DISSIPATION

SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

Semiconductor Device and Method of Making a Multi-Tier System-in-Pa...

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION AND METHOD FOR...

Semiconductor Device and Method of Forming Interconnect Structure w...

Semiconductor Device and Method of Partial Shielding with Embedded...

Semiconductor Device and Method of Forming an Antenna-in-Package St...

Semiconductor Device and Method of Forming a 3-D Stacked Semiconduc...

Semiconductor Device and Method of Forming Compartment Shielding fo...

Semiconductor Device and Method of Forming Fine Pitch Conductive Po...

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

Semiconductor Device and Method of Making a Semiconductor Package w...