Heh-Chang Huang

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,015,023
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having warpage control and method of f...
- Patent number 11,978,729
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Heh-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure
- Patent number 11,804,445
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Heh-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, integrated optical communication system
- Patent number 11,764,123
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, integrated optical communication system
- Patent number 11,694,939
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a dummy die of an integrated circuit having an em...
- Patent number 11,101,260
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with dummy bump and method for forming the same
- Patent number 10,872,871
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE PACKAGE WITH WARPAGE CONTROL
- Publication number 20240379640
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Heh-Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240297166
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL
- Publication number 20240145448
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Heh-Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH CONDUCTIVE PILLAR
- Publication number 20230378079
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Heh-Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL AND METHOD OF F...
- Publication number 20230012350
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Heh-Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220352083
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Heh-Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, INTEGRATED OPTICAL COMMUNICATION SYSTEM
- Publication number 20220336309
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, INTEGRATED OPTICAL COMMUNICATION SYSTEM
- Publication number 20210366802
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20210320097
- Publication date Oct 14, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH DUMMY BUMP AND METHOD FOR FORMING THE SAME
- Publication number 20200203299
- Publication date Jun 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Hui HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20190237454
- Publication date Aug 1, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS

Heh-Chang Huang

Person

Patents Grantslast 30 patents

Integrated circuit package and method of forming same

Semiconductor device package having warpage control and method of f...

Method for forming chip package structure

Semiconductor package, integrated optical communication system

Semiconductor package, integrated optical communication system

Method of forming a dummy die of an integrated circuit having an em...

Chip package structure with dummy bump and method for forming the same

Patents Applicationslast 30 patents

METHOD OF FORMING A SEMICONDUCTOR DEVICE PACKAGE WITH WARPAGE CONTROL

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL

CHIP PACKAGE STRUCTURE WITH CONDUCTIVE PILLAR

SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL AND METHOD OF F...

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE, INTEGRATED OPTICAL COMMUNICATION SYSTEM

SEMICONDUCTOR PACKAGE, INTEGRATED OPTICAL COMMUNICATION SYSTEM

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

CHIP PACKAGE STRUCTURE WITH DUMMY BUMP AND METHOD FOR FORMING THE SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME