Heidi Baks

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Poughkeepsie, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming an interconnect structure
- Patent number 7,358,182
- Issue date Apr 15, 2008
- International Business Machines Corporation
- Heidi Lee Baks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming damascene structure utilizing planarizing materi...
- Patent number 7,326,651
- Issue date Feb 5, 2008
- International Business Machines Corporation
- Heidi Baks
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTIMIZED SiCN CAPPING LAYER
- Publication number 20090176367
- Publication date Jul 9, 2009
- Heidi Baks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN INTERCONNECT STRUCTURE
- Publication number 20080146029
- Publication date Jun 19, 2008
- Heidi Lee Baks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED SiCN CAPPING LAYER
- Publication number 20070155186
- Publication date Jul 5, 2007
- International Business Machines Corporation
- Heidi Baks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming an interconnect structure
- Publication number 20070148966
- Publication date Jun 28, 2007
- Heidi Lee Baks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING DAMASCENE STRUCTURE UTILIZING PLANARIZING MATERI...
- Publication number 20050079701
- Publication date Apr 14, 2005
- International Business Machines Corporation
- Heidi Baks
- H01 - BASIC ELECTRIC ELEMENTS