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Heidi Lan

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer processing method
    • Patent number 11,724,352
    • Issue date Aug 15, 2023
    • Disco Corporation
    • Toshiyuki Sakai
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Manufacturing method of device chip
    • Patent number 11,024,542
    • Issue date Jun 1, 2021
    • Disco Corporation
    • Heidi Lan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing method
    • Patent number 10,991,622
    • Issue date Apr 27, 2021
    • DISCO CORPORTION
    • Meiyu Piao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing method
    • Patent number 10,991,623
    • Issue date Apr 27, 2021
    • Disco Corporation
    • Masatoshi Wakahara
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 10,784,166
    • Issue date Sep 22, 2020
    • Disco Corporation
    • Meiyu Piao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Processing method of wafer
    • Patent number 10,707,129
    • Issue date Jul 7, 2020
    • Disco Corporation
    • Tetsukazu Sugiya
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210370460
    • Publication date Dec 2, 2021
    • Disco Corporation
    • Toshiyuki SAKAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MANUFACTURING METHOD OF DEVICE CHIP
    • Publication number 20200185275
    • Publication date Jun 11, 2020
    • Disco Corporation
    • Heidi LAN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200185227
    • Publication date Jun 11, 2020
    • Disco Corporation
    • Masatoshi WAKAHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200051861
    • Publication date Feb 13, 2020
    • Disco Corporation
    • Meiyu PIAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200051862
    • Publication date Feb 13, 2020
    • Disco Corporation
    • Meiyu PIAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSING METHOD OF WAFER
    • Publication number 20180226295
    • Publication date Aug 9, 2018
    • Disco Corporation
    • Tetsukazu Sugiya
    • H01 - BASIC ELECTRIC ELEMENTS