Heiko Backer

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Hamburg, DE

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus, device and method for wafer dicing
- Patent number 9,349,645
- Issue date May 24, 2016
- NXP B.V.
- Martin Lapke
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of soldering components on a carrier foil
- Patent number 5,878,941
- Issue date Mar 9, 1999
- U.S. Philips Corporation
- Heiko Backer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS, DEVICE AND METHOD FOR WAFER DICING
- Publication number 20150104931
- Publication date Apr 16, 2015
- NXP B.V.
- Martin Lapke
- B28 - WORKING CEMENT, CLAY, OR STONE