Heiko BRAML

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Wiesenttal, DE

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for the material-bonded connection of connection partners...
- Patent number 10,603,741
- Issue date Mar 31, 2020
- Semikron Elektronik GmbH & Co., KG
- Ingo Bogen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor substrates with metal contact layer and method...
- Patent number 9,768,036
- Issue date Sep 19, 2017
- Semikron Elektronik GmbH & Co., KG
- Christian Göbl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement
- Patent number 8,564,126
- Issue date Oct 22, 2013
- Semikron Elektronik GmbH & Co. KG
- Christian Goebl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with a hermetically tight circuit arrang...
- Patent number 8,324,717
- Issue date Dec 4, 2012
- Semikron Elektronik GmbH & Co., KG
- Christian Goebl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR THE MATERIAL-BONDED CONNECTION OF CONNECTION PARTNERS...
- Publication number 20170144246
- Publication date May 25, 2017
- SEMIKRON Elektronik GmbH & Co., KG
- Ingo BOGEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Arrangement
- Publication number 20100264537
- Publication date Oct 21, 2010
- SEMIKRON Elektronik GmbH & Co. KG
- Christian GOEBL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor module with a hermetically tight circuit arrang...
- Publication number 20100090328
- Publication date Apr 15, 2010
- SEMIKRON Elektronik GmbH & Co. KG
- Christian Goebl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor substrates with metal contact layer and method...
- Publication number 20090008784
- Publication date Jan 8, 2009
- SEMIKRON Elektronik GmbH & Co. KG
- Christian Gobl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sintered power semiconductor substrate and method of producing the...
- Publication number 20080292874
- Publication date Nov 27, 2008
- SEMIKRON Elektronik GmbH & Co. KG
- Christian GOBL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR