Heiko Stahl

Person

Reutlingen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing a micromechanical element
- Patent number 10,889,491
- Issue date Jan 12, 2021
- Robert Bosch GmbH
- Markus Kuhnke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a micromechanical component with an exposed pr...
- Patent number 10,775,253
- Issue date Sep 15, 2020
- Robert Bosch GmbH
- Heiko Stahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Polycrystalline material having low mechanical strain; method for p...
- Patent number 10,766,778
- Issue date Sep 8, 2020
- Robert Bosch GmbH
- Andreas Hartlieb
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing at least one via in a wafer
- Patent number 10,643,896
- Issue date May 5, 2020
- Robert Bosch GmbH
- Heiko Stahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a micromechanical component
- Patent number 10,336,610
- Issue date Jul 2, 2019
- Robert Bosch GmbH
- Heiko Stahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive MEMS-sensor element having bond pads for the electrical...
- Patent number 9,725,300
- Issue date Aug 8, 2017
- Robert Bosch GmbH
- Heiko Stahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method for cryptographic key identification
- Patent number 9,667,419
- Issue date May 30, 2017
- Robert Bosch GmbH
- Jorge Guajardo Merchan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Component including two semiconductor elements, which are bonded to...
- Patent number 9,650,240
- Issue date May 16, 2017
- Robert Bosch GmbH
- Mirko Hattass
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Component including two semiconductor elements between which at lea...
- Patent number 9,428,378
- Issue date Aug 30, 2016
- Robert Bosch GmbH
- Friedjof Heuck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical component having a bond joint
- Patent number 9,206,034
- Issue date Dec 8, 2015
- Robert Bosch GmbH
- Heiko Stahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing MEMS structures, and MEMS structure
- Patent number 8,563,344
- Issue date Oct 22, 2013
- Robert Bosch GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a micromechanical component
- Patent number 8,492,188
- Issue date Jul 23, 2013
- Robert Bosch GmbH
- Heiko Stahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor element and method for operating a sensor element
- Patent number 8,402,827
- Issue date Mar 26, 2013
- Robert Bosch GmbH
- Heiko Stahl
- G01 - MEASURING TESTING
Information Patent Grant
Micromechanical acceleration sensor having an open seismic mass
- Patent number 8,393,215
- Issue date Mar 12, 2013
- Robert Bosch GmbH
- Heiko Stahl
- G01 - MEASURING TESTING
Information Patent Grant
Micromechanical component having multiple caverns, and manufacturin...
- Patent number 8,174,082
- Issue date May 8, 2012
- Robert Bosch GmbH
- Frank Fischer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical diaphragm sensor having a double diaphragm
- Patent number 7,863,072
- Issue date Jan 4, 2011
- Robert Bosch GmbH
- Matthias Illing
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micropump having a pump diaphragm and a polysilicon layer
- Patent number 7,740,459
- Issue date Jun 22, 2010
- Robert Bosch GmbH
- Matthias Fuertsch
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Micromechanical component having an anodically bonded cap and a man...
- Patent number 7,436,076
- Issue date Oct 14, 2008
- Robert Bosch GmbH
- Heiko Stahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTROMECHANICAL DEVICE
- Publication number 20250199414
- Publication date Jun 19, 2025
- ROBERT BOSCH GmbH
- Ralf NOLTEMEYER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A BONDING PAD FOR A MICROMECHANICAL SENSOR ELE...
- Publication number 20230219808
- Publication date Jul 13, 2023
- ROBERT BOSCH GmbH
- Andreas Prinzen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING AT LEAST ONE FIRST AND ONE SECOND MICROMIRROR...
- Publication number 20230066345
- Publication date Mar 2, 2023
- ROBERT BOSCH GmbH
- Heiko Stahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT WITH AN EXPOSED PR...
- Publication number 20200225108
- Publication date Jul 16, 2020
- ROBERT BOSCH GmbH
- Heiko Stahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Producing a Micromechanical Element
- Publication number 20190092628
- Publication date Mar 28, 2019
- ROBERT BOSCH GmbH
- Markus Kuhnke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Producing at least One Via in a Wafer
- Publication number 20190096762
- Publication date Mar 28, 2019
- ROBERT BOSCH GmbH
- Heiko Stahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYCRYSTALLINE MATERIAL HAVING LOW MECHANICAL STRAIN; METHOD FOR P...
- Publication number 20180346339
- Publication date Dec 6, 2018
- ROBERT BOSCH GmbH
- Andreas Hartlieb
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT
- Publication number 20180111828
- Publication date Apr 26, 2018
- ROBERT BOSCH GmbH
- Heiko Stahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT HAVING INTEGRATED PASSIVE ELECTRONIC COMP...
- Publication number 20170283253
- Publication date Oct 5, 2017
- ROBERT BOSCH GmbH
- Heiko Stahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE MEMS-SENSOR ELEMENT HAVING BOND PADS FOR THE ELECTRICAL...
- Publication number 20160280534
- Publication date Sep 29, 2016
- ROBERT BOSCH GmbH
- Heiko Stahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Component including two semiconductor elements between which at lea...
- Publication number 20150353346
- Publication date Dec 10, 2015
- ROBERT BOSCH GmbH
- Friedjof HEUCK
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPONENT INCLUDING TWO SEMICONDUCTOR ELEMENTS, WHICH ARE BONDED TO...
- Publication number 20150353349
- Publication date Dec 10, 2015
- Robert Bosch GmbH
- Mirko HATTASS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LAYER STRUCTURE FOR A MICROMECHANICAL COMPONENT
- Publication number 20150232331
- Publication date Aug 20, 2015
- ROBERT BOSCH GmbH
- Axel GROSSE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM AND METHOD FOR CRYPTOGRAPHIC KEY IDENTIFICATION
- Publication number 20150200775
- Publication date Jul 16, 2015
- ROBERT BOSCH GmbH
- Jorge Guajardo Merchan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Micromechanical component having a bond joint
- Publication number 20140117471
- Publication date May 1, 2014
- ROBERT BOSCH GmbH
- Heiko STAHL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for producing MEMS structures, and MEMS structure
- Publication number 20120133002
- Publication date May 31, 2012
- Jochen REINMUTH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT
- Publication number 20120129291
- Publication date May 24, 2012
- Heiko Stahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR ELEMENT AND METHOD FOR OPERATING A SENSOR ELEMENT
- Publication number 20110030475
- Publication date Feb 10, 2011
- Heiko Stahl
- G01 - MEASURING TESTING
Information Patent Application
MICROMECHANICAL ACCELERATION SENSOR HAVING AN OPEN SEISMIC MASS
- Publication number 20090314085
- Publication date Dec 24, 2009
- Heiko Stahl
- G01 - MEASURING TESTING
Information Patent Application
Micromechanical diaphragm sensor having a double diaphragm
- Publication number 20090206422
- Publication date Aug 20, 2009
- Matthias Illing
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micromechanical component having integrated passive electronic comp...
- Publication number 20080164564
- Publication date Jul 10, 2008
- Heiko Stahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micromechanical Component Having Multiple Caverns, and Manufacturin...
- Publication number 20080136000
- Publication date Jun 12, 2008
- Frank Fischer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micromechanical component having an anodically bonded cap and a man...
- Publication number 20070087465
- Publication date Apr 19, 2007
- Heiko Stahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for the production of a micromechanical part preferably used...
- Publication number 20060186085
- Publication date Aug 24, 2006
- Matthias Fuertsch
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...

Heiko Stahl

Person

Patents Grantslast 30 patents

Method for producing a micromechanical element

Method for producing a micromechanical component with an exposed pr...

Polycrystalline material having low mechanical strain; method for p...

Method for producing at least one via in a wafer

Method for producing a micromechanical component

Capacitive MEMS-sensor element having bond pads for the electrical...

System and method for cryptographic key identification

Component including two semiconductor elements, which are bonded to...

Component including two semiconductor elements between which at lea...

Micromechanical component having a bond joint

Method for producing MEMS structures, and MEMS structure

Method for producing a micromechanical component

Sensor element and method for operating a sensor element

Micromechanical acceleration sensor having an open seismic mass

Micromechanical component having multiple caverns, and manufacturin...

Micromechanical diaphragm sensor having a double diaphragm

Micropump having a pump diaphragm and a polysilicon layer

Micromechanical component having an anodically bonded cap and a man...

Patents Applicationslast 30 patents

MICROELECTROMECHANICAL DEVICE

METHOD FOR PRODUCING A BONDING PAD FOR A MICROMECHANICAL SENSOR ELE...

METHOD FOR PRODUCING AT LEAST ONE FIRST AND ONE SECOND MICROMIRROR...

METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT WITH AN EXPOSED PR...

Method for Producing a Micromechanical Element

Method for Producing at least One Via in a Wafer

POLYCRYSTALLINE MATERIAL HAVING LOW MECHANICAL STRAIN; METHOD FOR P...

METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT

MICROMECHANICAL COMPONENT HAVING INTEGRATED PASSIVE ELECTRONIC COMP...

CAPACITIVE MEMS-SENSOR ELEMENT HAVING BOND PADS FOR THE ELECTRICAL...

Component including two semiconductor elements between which at lea...

COMPONENT INCLUDING TWO SEMICONDUCTOR ELEMENTS, WHICH ARE BONDED TO...

LAYER STRUCTURE FOR A MICROMECHANICAL COMPONENT

SYSTEM AND METHOD FOR CRYPTOGRAPHIC KEY IDENTIFICATION

Micromechanical component having a bond joint

Method for producing MEMS structures, and MEMS structure

METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT

SENSOR ELEMENT AND METHOD FOR OPERATING A SENSOR ELEMENT

MICROMECHANICAL ACCELERATION SENSOR HAVING AN OPEN SEISMIC MASS

Micromechanical diaphragm sensor having a double diaphragm

Micromechanical component having integrated passive electronic comp...

Micromechanical Component Having Multiple Caverns, and Manufacturin...

Micromechanical component having an anodically bonded cap and a man...

Method for the production of a micromechanical part preferably used...