Heimo Scheucher

Person

Langegg, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Maximizing potential good die per wafer, PGDW
- Patent number 9,798,228
- Issue date Oct 24, 2017
- NXP B.V.
- Hans Cobussen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor wafer and method of producing the same
- Patent number 9,754,832
- Issue date Sep 5, 2017
- NXP B.V.
- Florian Schmitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits on a wafer and methods for manufacturing integr...
- Patent number 9,620,456
- Issue date Apr 11, 2017
- NXP B.V.
- Heimo Scheucher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip having two groups of chip contacts
- Patent number 9,318,428
- Issue date Apr 19, 2016
- NXP B.V.
- Heimo Scheucher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Individual ROM codes on a single reticle for a plurality of devices
- Patent number 8,701,077
- Issue date Apr 15, 2014
- NXP B.V.
- Stefan Lemsitzer
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuits on a wafer and method for separating integrated...
- Patent number 8,415,769
- Issue date Apr 9, 2013
- NXP B.V.
- Heimo Scheucher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits on a wafer and methods for manufacturing integr...
- Patent number 8,349,708
- Issue date Jan 8, 2013
- NXP B.V.
- Heimo Scheucher
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Integrated circuits on a wafer and method of producing integrated c...
- Patent number 8,264,092
- Issue date Sep 11, 2012
- NXP B.V.
- Heimo Scheucher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data carrier comprising strain gauge means
- Patent number 7,884,722
- Issue date Feb 8, 2011
- NXP B.V.
- Heimo Scheucher
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer with improved sawing loops
- Patent number 7,576,412
- Issue date Aug 18, 2009
- NXP B.V.
- Scheucher Heimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer with optical control modules in exposure fields
- Patent number 7,538,444
- Issue date May 26, 2009
- Heimo Scheucher
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Wafer with optical control modules in dicing paths
- Patent number 7,508,051
- Issue date Mar 24, 2009
- NXP B.V.
- Heimo Scheucher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer with optical control modules in IC fields
- Patent number 7,456,489
- Issue date Nov 25, 2008
- NXP B.V.
- Heimo Scheucher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with at least one bump
- Patent number 7,247,943
- Issue date Jul 24, 2007
- NXP B.V.
- Heimo Scheucher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer with process control modules
- Patent number 6,680,523
- Issue date Jan 20, 2004
- Joachim H. Schober
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MAXIMIZING POTENTIAL GOOD DIE PER WAFER, PGDW
- Publication number 20170092636
- Publication date Mar 30, 2017
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer and method of producing the same
- Publication number 20120306056
- Publication date Dec 6, 2012
- NXP B.V.
- Florian Schmitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuits On A Wafer and Method For Separating Integrated...
- Publication number 20100270655
- Publication date Oct 28, 2010
- NXP B.V.
- Heimo Scheucher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA CARRIER COMPRISING STRAIN GAUGE MEANS
- Publication number 20100225483
- Publication date Sep 9, 2010
- NXP B.V.
- Heimo Scheucher
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUITS ON A WAFER AND METHODS FOR MANUFACTURING INTEGR...
- Publication number 20100181568
- Publication date Jul 22, 2010
- NXP B.V.
- Heimo Scheucher
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
INTEGRATED CIRCUITS ON A WAFER AND METHOD OF PRODUCING INTEGRATED C...
- Publication number 20100155967
- Publication date Jun 24, 2010
- NXP B.V.
- Heimo Scheucher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS ON A WAFER AND METHODS FOR MANUFACTURING INTEGR...
- Publication number 20100140748
- Publication date Jun 10, 2010
- NXP B.V.
- Heimo Scheucher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Comprising at Least One Test Contact Configuration
- Publication number 20080067509
- Publication date Mar 20, 2008
- Koninklijke Philips Electronics N.V.
- Heimo Scheucher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Having Two Groups Of Chip Contacts
- Publication number 20080017980
- Publication date Jan 24, 2008
- Koninklijke Philips Electronics N.V.
- Heimo Scheucher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer With Improved Sawing Loops
- Publication number 20080001259
- Publication date Jan 3, 2008
- Koninklijke Philips Electronics N.V.
- Heimo Scheucher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer with optical control modules in ic fields
- Publication number 20070158798
- Publication date Jul 12, 2007
- Koninklijke Philips Electronics N.V.
- Heimo Scheucher
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Wafer with optical control modules in exposure fields
- Publication number 20070152303
- Publication date Jul 5, 2007
- Heimo Scheucher
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Wafer with optical control modules in dicing paths
- Publication number 20070111352
- Publication date May 17, 2007
- Koninklijke Philips Electronics N.V.
- Heimo Scheucher
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Electro-acoustic transducer comprising an rfid circuit
- Publication number 20070086605
- Publication date Apr 19, 2007
- Koninklijke Philips Electronics N.V.
- Heimo Scheucher
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Integrated circuit with at least one bump
- Publication number 20060071240
- Publication date Apr 6, 2006
- Heimo Scheucher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer with process control modules
- Publication number 20020117735
- Publication date Aug 29, 2002
- U.S. PHILIPS CORPORATION
- Joachim H. Schober
- H01 - BASIC ELECTRIC ELEMENTS

Heimo Scheucher

Person

Patents Grantslast 30 patents

Maximizing potential good die per wafer, PGDW

Semiconductor wafer and method of producing the same

Integrated circuits on a wafer and methods for manufacturing integr...

Chip having two groups of chip contacts

Individual ROM codes on a single reticle for a plurality of devices

Integrated circuits on a wafer and method for separating integrated...

Integrated circuits on a wafer and methods for manufacturing integr...

Integrated circuits on a wafer and method of producing integrated c...

Data carrier comprising strain gauge means

Wafer with improved sawing loops

Wafer with optical control modules in exposure fields

Wafer with optical control modules in dicing paths

Wafer with optical control modules in IC fields

Integrated circuit with at least one bump

Semiconductor wafer with process control modules

Patents Applicationslast 30 patents

MAXIMIZING POTENTIAL GOOD DIE PER WAFER, PGDW

Semiconductor wafer and method of producing the same

Integrated Circuits On A Wafer and Method For Separating Integrated...

DATA CARRIER COMPRISING STRAIN GAUGE MEANS

INTEGRATED CIRCUITS ON A WAFER AND METHODS FOR MANUFACTURING INTEGR...

INTEGRATED CIRCUITS ON A WAFER AND METHOD OF PRODUCING INTEGRATED C...

INTEGRATED CIRCUITS ON A WAFER AND METHODS FOR MANUFACTURING INTEGR...

Chip Comprising at Least One Test Contact Configuration

Chip Having Two Groups Of Chip Contacts

Wafer With Improved Sawing Loops

Wafer with optical control modules in ic fields

Wafer with optical control modules in exposure fields

Wafer with optical control modules in dicing paths

Electro-acoustic transducer comprising an rfid circuit

Integrated circuit with at least one bump

Semiconductor wafer with process control modules