Heinrich HEILBRONNER

Person

Stein bei Nurnberg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing a switching device with a moisture-tight and e...
- Patent number 9,883,596
- Issue date Jan 30, 2018
- Semikron Elektronik GmbH & Co., KG
- Christian Göbl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor component with metal contact layer and producti...
- Patent number 8,110,925
- Issue date Feb 7, 2012
- Semikron Elektronik GmbH & Co., KG
- Christian Goebl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with reduced parasitic inductance
- Patent number 7,751,207
- Issue date Jul 6, 2010
- Semikron Elektronik GmbH & Co. KG
- Dejan Schreiber
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Low-inductance circuit arrangement for power semiconductor modules
- Patent number 7,227,259
- Issue date Jun 5, 2007
- Semikron Elektronik GmbH & Co. KG
- Heinrich Heilbronner
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power semiconductor module and method for producing it
- Patent number 7,042,074
- Issue date May 9, 2006
- SEMIKRON Elektronik GmbH & Co., KG
- Christian Göbl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter circuit and associated triggering method for genera...
- Patent number 7,012,409
- Issue date Mar 14, 2006
- SEMIKRON Elektronik GmbH & Co. KG
- Dejan Schreiber
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power semiconductor module with pressure contact means
- Patent number 6,881,071
- Issue date Apr 19, 2005
- Semikron Elektronik GmbH
- Heinrich Heilbronner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor module
- Patent number 6,831,359
- Issue date Dec 14, 2004
- Semikron Elektronik GmbH
- Heinrich Heilbronner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer semiconductor device having high packing density
- Patent number 5,856,913
- Issue date Jan 5, 1999
- Semikron Elektronik GmbH
- Heinrich Heilbronner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density, heat-dissipating circuit assembly with accessible com...
- Patent number 5,438,479
- Issue date Aug 1, 1995
- Export-Contor Aussenhandelsgesellschaft mbH
- Heinrich Heilbronner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit arrangement with a cooling member
- Patent number 5,296,739
- Issue date Mar 22, 1994
- Export-Contor Aussenhandelsgesellschaft mbH
- Heinrich Heilbronner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for producing a switching device with a moisture-tight and e...
- Publication number 20160120038
- Publication date Apr 28, 2016
- SEMIKRON Elektronik GmbH & Co., KG
- Christian GÖBL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power semiconductor component with metal contact layer and producti...
- Publication number 20090039516
- Publication date Feb 12, 2009
- SEMIKRON Elektronik GmbH & Co. KG
- Christian Goebl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor module with reduced parasitic inductance
- Publication number 20060158914
- Publication date Jul 20, 2006
- Dejan Schreiber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power converter circuit and associated triggering method for genera...
- Publication number 20050200337
- Publication date Sep 15, 2005
- SEMIKRON ELEKTRONIK GmbH
- Dejan Schreiber
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Power semiconductor module and method for producing it
- Publication number 20050127503
- Publication date Jun 16, 2005
- SEMIKRON ELEKTRONIK GmbH
- Christian Gobl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-inductance circuit arrangement for power semiconductor modules
- Publication number 20050024805
- Publication date Feb 3, 2005
- Heinrich Heilbronner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor module
- Publication number 20040108589
- Publication date Jun 10, 2004
- Heinrich Heilbronner
- B82 - NANO-TECHNOLOGY
Information Patent Application
Power semiconductor module with pressure contact means
- Publication number 20020173192
- Publication date Nov 21, 2002
- SEMIKRON ELEKTRONIK GmbH
- Heinrich Heilbronner
- H01 - BASIC ELECTRIC ELEMENTS

Heinrich HEILBRONNER

Person

Patents Grantslast 30 patents

Method for producing a switching device with a moisture-tight and e...

Power semiconductor component with metal contact layer and producti...

Power semiconductor module with reduced parasitic inductance

Low-inductance circuit arrangement for power semiconductor modules

Power semiconductor module and method for producing it

Power converter circuit and associated triggering method for genera...

Power semiconductor module with pressure contact means

Power semiconductor module

Multilayer semiconductor device having high packing density

High density, heat-dissipating circuit assembly with accessible com...

Circuit arrangement with a cooling member

Patents Applicationslast 30 patents

Method for producing a switching device with a moisture-tight and e...

Power semiconductor component with metal contact layer and producti...

Power semiconductor module with reduced parasitic inductance

Power converter circuit and associated triggering method for genera...

Power semiconductor module and method for producing it

Low-inductance circuit arrangement for power semiconductor modules

Power semiconductor module

Power semiconductor module with pressure contact means