Heinrich Hennhofer

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Altotting, DE

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Patents Grantslast 30 patents

Information Patent Grant
Process for the surface polishing of silicon wafers
- Patent number 6,530,826
- Issue date Mar 11, 2003
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Guido Wenski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and device for polishing semiconductor wafers
- Patent number 6,095,898
- Issue date Aug 1, 2000
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Heinrich Hennhofer
- B24 - GRINDING POLISHING
Information Patent Grant
Method and device for polishing semiconductor wafers
- Patent number 5,980,361
- Issue date Nov 9, 1999
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Paul Muller
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
PROCESS FOR TREATING A POLISHED SEMICONDUCTOR WATER IMMEDIATELY AFT...
- Publication number 20020187639
- Publication date Dec 12, 2002
- HEINRICH HENNHOFER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for the surface polishing of silicon wafers
- Publication number 20020077039
- Publication date Jun 20, 2002
- WACKER, SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AG
- Guido Wenski
- H01 - BASIC ELECTRIC ELEMENTS