Heinrich Koerner

Person

Buckmuehl, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrical contact and method of forming a chi...
- Patent number 10,978,418
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for forming a semiconductor device
- Patent number 10,867,893
- Issue date Dec 15, 2020
- Infineon Technologies AG
- Sergey Ananiev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a chip package with compounds to improve the dur...
- Patent number 10,672,678
- Issue date Jun 2, 2020
- Infineon Technologies AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package comprising a chemical compound and a method of forming...
- Patent number 10,497,634
- Issue date Dec 3, 2019
- Infineon Technologies AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package with a metal cont...
- Patent number 10,461,056
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package
- Patent number 9,941,181
- Issue date Apr 10, 2018
- Infineon Technologies AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Long-term heat treated integrated circuit arrangements and methods...
- Patent number 9,543,199
- Issue date Jan 10, 2017
- Infineon Technologies AG
- Oliver Aubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip RF shields with backside redistribution lines
- Patent number 9,390,973
- Issue date Jul 12, 2016
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for making same
- Patent number 9,312,172
- Issue date Apr 12, 2016
- Infineon Technologies AG
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a multifunctional dielectric layer on a subst...
- Patent number 9,269,669
- Issue date Feb 23, 2016
- Infineon Technologies AG
- Johann Helneder
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method for making same
- Patent number 9,263,328
- Issue date Feb 16, 2016
- Infineon Technologies AG
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for making same
- Patent number 8,994,179
- Issue date Mar 31, 2015
- Infineon Technologies AG
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making interconnect structure
- Patent number 8,946,074
- Issue date Feb 3, 2015
- Infineon Technologies AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip RF shields with backside redistribution lines
- Patent number 8,889,548
- Issue date Nov 18, 2014
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on a chip with on-chip RF shield
- Patent number 8,748,287
- Issue date Jun 10, 2014
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Long-term heat-treated integrated circuit arrangements and methods...
- Patent number 8,643,183
- Issue date Feb 4, 2014
- Infineon Technologies AG
- Oliver Aubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on a chip with on-chip RF shield
- Patent number 8,536,683
- Issue date Sep 17, 2013
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for integrated circuit arrangement having a plura...
- Patent number 8,258,628
- Issue date Sep 4, 2012
- Infineon Technologies AG
- Martina Hommel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip radio frequency shield with interconnect metallization
- Patent number 8,063,469
- Issue date Nov 22, 2011
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 8,049,336
- Issue date Nov 1, 2011
- Infineon Technologies, AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit arrangement with layer stack
- Patent number 7,960,832
- Issue date Jun 14, 2011
- Infineon Technologies AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on a chip with on-chip RF shield
- Patent number 7,948,064
- Issue date May 24, 2011
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip RF shields with backside redistribution lines
- Patent number 7,936,052
- Issue date May 3, 2011
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit arrangement having a plurality of conductive str...
- Patent number 7,667,256
- Issue date Feb 23, 2010
- Infineon Technologies AG
- Martina Hommel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with improved component interconnections
- Patent number 7,656,037
- Issue date Feb 2, 2010
- Infineon Technologies AG
- Martina Hommel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for metallizing submicron contact holes in semiconductor bodies
- Patent number 6,057,229
- Issue date May 2, 2000
- Siemens Aktiengesellschaft
- Konrad Hieber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for producing conductive layers or structures...
- Patent number 5,478,780
- Issue date Dec 26, 1995
- Siemens Aktiengesellschaft
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20210082861
- Publication date Mar 18, 2021
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE WITH A METAL CONT...
- Publication number 20200013749
- Publication date Jan 9, 2020
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING A CHIP PACKAGE
- Publication number 20190287875
- Publication date Sep 19, 2019
- INFINEON TECHNOLOGIES AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods for Forming a Semiconductor Device
- Publication number 20180061742
- Publication date Mar 1, 2018
- INFINEON TECHNOLOGIES AG
- Sergey Ananiev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20170338165
- Publication date Nov 23, 2017
- INFINEON TECHNOLOGIES AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20170338169
- Publication date Nov 23, 2017
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20170338164
- Publication date Nov 23, 2017
- INFINEON TECHNOLOGIES AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Long-term heat treated integrated circuit arrangements and methods...
- Publication number 20160049329
- Publication date Feb 18, 2016
- INFINEON TECHNOLOGIES AG
- Oliver Aubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Making Same
- Publication number 20150206797
- Publication date Jul 23, 2015
- INFINEON TECHNOLOGIES AG
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Making Same
- Publication number 20150054175
- Publication date Feb 26, 2015
- INFINEON TECHNOLOGIES AG
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On-Chip RF Shields with Backside Redistribution Lines
- Publication number 20150024591
- Publication date Jan 22, 2015
- INFINEON TECHNOLOGIES AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elimination of Die-Top Delamination
- Publication number 20140339690
- Publication date Nov 20, 2014
- Swee Guan Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System on a Chip with On-Chip RF Shield
- Publication number 20140017876
- Publication date Jan 16, 2014
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On-Chip RF Shields with Backside Redistribution Lines
- Publication number 20120258594
- Publication date Oct 11, 2012
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Producing a Multifunctional Dielectric Layer on a Subst...
- Publication number 20120149168
- Publication date Jun 14, 2012
- Johann Helneder
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MAKING INTERCONNECT STRUCTURE
- Publication number 20120045893
- Publication date Feb 23, 2012
- Heinrich KOERNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System on a Chip with On-Chip RF Shield
- Publication number 20110201175
- Publication date Aug 18, 2011
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On-Chip Radio Frequency Shield with Interconnect Metallization
- Publication number 20100078777
- Publication date Apr 1, 2010
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On-Chip RF Shields with Backside Redistribution Lines
- Publication number 20100078776
- Publication date Apr 1, 2010
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System on a Chip with On-Chip RF Shield
- Publication number 20100078779
- Publication date Apr 1, 2010
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure
- Publication number 20100078817
- Publication date Apr 1, 2010
- Heinrich KOERNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Making Same
- Publication number 20100052178
- Publication date Mar 4, 2010
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for integrated circuit arrangement having a plura...
- Publication number 20080224318
- Publication date Sep 18, 2008
- Martina Hommel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method For Determining Reliability Of An Integrated C...
- Publication number 20080197870
- Publication date Aug 21, 2008
- INFINEON TECHNOLOGIES AG
- Heinrich Koerner
- G01 - MEASURING TESTING
Information Patent Application
Long-term heat-treated integrated circuit arrangements and methods...
- Publication number 20070105366
- Publication date May 10, 2007
- Oliver Aubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit arrangement having a plurality of conductive str...
- Publication number 20070071053
- Publication date Mar 29, 2007
- Martina Hommel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit arrangement having a plurality of conductive str...
- Publication number 20070071052
- Publication date Mar 29, 2007
- Martina Hommel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit arrangement with layer stack, and process
- Publication number 20060267205
- Publication date Nov 30, 2006
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for producing a multifunctional dielectric layer on a subst...
- Publication number 20060222760
- Publication date Oct 5, 2006
- Johann Helneder
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Heinrich Koerner

Person

Patents Grantslast 30 patents

Chip package, method of forming a chip package and method of formin...

Method of forming an electrical contact and method of forming a chi...

Semiconductor devices and methods for forming a semiconductor device

Method for forming a chip package with compounds to improve the dur...

Chip package comprising a chemical compound and a method of forming...

Chip package and method of forming a chip package with a metal cont...

Chip package and method of forming a chip package

Long-term heat treated integrated circuit arrangements and methods...

On-chip RF shields with backside redistribution lines

Semiconductor device and method for making same

Process for producing a multifunctional dielectric layer on a subst...

Semiconductor device and method for making same

Semiconductor device and method for making same

Method of making interconnect structure

On-chip RF shields with backside redistribution lines

System on a chip with on-chip RF shield

Long-term heat-treated integrated circuit arrangements and methods...

System on a chip with on-chip RF shield

System and method for integrated circuit arrangement having a plura...

On-chip radio frequency shield with interconnect metallization

Interconnect structure

Integrated circuit arrangement with layer stack

System on a chip with on-chip RF shield

On-chip RF shields with backside redistribution lines

Integrated circuit arrangement having a plurality of conductive str...

Integrated circuit with improved component interconnections

Method for metallizing submicron contact holes in semiconductor bodies

Method and apparatus for producing conductive layers or structures...

Patents Applicationslast 30 patents

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE WITH A METAL CONT...

METHODS FOR FORMING A CHIP PACKAGE

Semiconductor Devices and Methods for Forming a Semiconductor Device

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

Long-term heat treated integrated circuit arrangements and methods...

Semiconductor Device and Method for Making Same

Semiconductor Device and Method for Making Same

On-Chip RF Shields with Backside Redistribution Lines

Elimination of Die-Top Delamination

System on a Chip with On-Chip RF Shield

On-Chip RF Shields with Backside Redistribution Lines

Process for Producing a Multifunctional Dielectric Layer on a Subst...

METHOD OF MAKING INTERCONNECT STRUCTURE

System on a Chip with On-Chip RF Shield

On-Chip Radio Frequency Shield with Interconnect Metallization

On-Chip RF Shields with Backside Redistribution Lines

System on a Chip with On-Chip RF Shield

Interconnect Structure

Semiconductor Device and Method for Making Same

System and method for integrated circuit arrangement having a plura...

Apparatus and Method For Determining Reliability Of An Integrated C...

Long-term heat-treated integrated circuit arrangements and methods...

Integrated circuit arrangement having a plurality of conductive str...

Integrated circuit arrangement having a plurality of conductive str...

Integrated circuit arrangement with layer stack, and process

Process for producing a multifunctional dielectric layer on a subst...