Heinz-Peter Wirtz

Person

Dottingen, CH

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
- Patent number 12,094,729
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a wafer-level chip-scale...
- Patent number 11,961,764
- Issue date Apr 16, 2024
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
- Patent number 11,222,793
- Issue date Jan 11, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using a standardized carrier in...
- Patent number 11,011,423
- Issue date May 18, 2021
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing encapsulant along sides and surface edge of se...
- Patent number 10,515,828
- Issue date Dec 24, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using a standardized carrier in...
- Patent number 10,181,423
- Issue date Jan 15, 2019
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using a standardized carrier in...
- Patent number 9,620,413
- Issue date Apr 11, 2017
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of depositing encapsulant along sid...
- Patent number 9,496,195
- Issue date Nov 15, 2016
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and device
- Patent number 8,222,722
- Issue date Jul 17, 2012
- ST-Ericsson SA
- Nedyalko Slavov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated substrate for an integrated circuit BGA package and print...
- Patent number 8,125,074
- Issue date Feb 28, 2012
- ST-Ericsson SA
- Nedyalko Slavov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Portable object connectable package
- Patent number 7,692,280
- Issue date Apr 6, 2010
- ST-Ericsson SA
- Stefan Marco Koch
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device with Encapsulant Deposited Along Sides and Sur...
- Publication number 20220093417
- Publication date Mar 24, 2022
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier in...
- Publication number 20210233815
- Publication date Jul 29, 2021
- STATS ChipPAC Pte Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Encapsulant Deposited Along Sides and Sur...
- Publication number 20200090954
- Publication date Mar 19, 2020
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier in...
- Publication number 20190109048
- Publication date Apr 11, 2019
- STATS ChipPAC Pte Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier in...
- Publication number 20170133270
- Publication date May 11, 2017
- STATS ChipPAC Pte Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Depositing Encapsulant Along Sid...
- Publication number 20170011936
- Publication date Jan 12, 2017
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Depositing Encapsulant Along Sid...
- Publication number 20140091482
- Publication date Apr 3, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier in...
- Publication number 20140091455
- Publication date Apr 3, 2014
- STATS ChipPAC, Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE OR PACKAGE AND INTEGRATED CIRCUIT SYSTEM,...
- Publication number 20110064362
- Publication date Mar 17, 2011
- ST-ERICSSON SA
- Nedyalko Slavov
- G02 - OPTICS
Information Patent Application
LAMINATED SUBSTRATE FOR AN INTEGRATED CIRCUIT BGA PACKAGE AND PRINT...
- Publication number 20110061917
- Publication date Mar 17, 2011
- ST-ERICSSON SA
- Nedyalko Slavov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND DEVICE
- Publication number 20110062576
- Publication date Mar 17, 2011
- ST-ERICSSON SA
- Nedyalko Slavov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Portable Object Connectable Package
- Publication number 20080224288
- Publication date Sep 18, 2008
- NXP B.V.
- Stefan Marco Koch
- H01 - BASIC ELECTRIC ELEMENTS

Heinz-Peter Wirtz

Person

Patents Grantslast 30 patents

Semiconductor device with encapsulant deposited along sides and sur...

Semiconductor device and method of making a wafer-level chip-scale...

Semiconductor device with encapsulant deposited along sides and sur...

Semiconductor device and method of using a standardized carrier in...

Method of depositing encapsulant along sides and surface edge of se...

Semiconductor device and method of using a standardized carrier in...

Semiconductor device and method of using a standardized carrier in...

Semiconductor device and method of depositing encapsulant along sid...

Integrated circuit package and device

Laminated substrate for an integrated circuit BGA package and print...

Portable object connectable package

Patents Applicationslast 30 patents

Semiconductor Device with Encapsulant Deposited Along Sides and Sur...

Semiconductor Device and Method of Using a Standardized Carrier in...

Semiconductor Device with Encapsulant Deposited Along Sides and Sur...

Semiconductor Device and Method of Using a Standardized Carrier in...

Semiconductor Device and Method of Using a Standardized Carrier in...

Semiconductor Device and Method of Depositing Encapsulant Along Sid...

Semiconductor Device and Method of Depositing Encapsulant Along Sid...

Semiconductor Device and Method of Using a Standardized Carrier in...

INTEGRATED CIRCUIT DEVICE OR PACKAGE AND INTEGRATED CIRCUIT SYSTEM,...

LAMINATED SUBSTRATE FOR AN INTEGRATED CIRCUIT BGA PACKAGE AND PRINT...

INTEGRATED CIRCUIT PACKAGE AND DEVICE

Portable Object Connectable Package