Hejin Liu

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Tianjin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assembled using two lead frames
- Patent number 9,209,119
- Issue date Dec 8, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Huan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Helix substrate and three-dimensional package with same
- Patent number 8,907,464
- Issue date Dec 9, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Huan Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Brace for wire bond
- Patent number 8,524,529
- Issue date Sep 3, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Meiquan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for monitoring free air ball (FAB) formation i...
- Patent number 8,496,158
- Issue date Jul 30, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Fei Zong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual die semiconductor package
- Patent number 8,288,847
- Issue date Oct 16, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Meiquan Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLED USING TWO LEAD FRAMES
- Publication number 20150357266
- Publication date Dec 10, 2015
- Huan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HELIX SUBSTRATE AND THREE-DIMENSIONAL PACKAGE WITH SAME
- Publication number 20140146497
- Publication date May 29, 2014
- Huan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MONITORING FREE AIR BALL (FAB) FORMATION I...
- Publication number 20130119114
- Publication date May 16, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Fei ZONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF ASSEMBLING SEMICONDUCTOR DEVICE
- Publication number 20120326288
- Publication date Dec 27, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Meiquan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRACE FOR WIRE BOND
- Publication number 20120077316
- Publication date Mar 29, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Meiquan HUANG
- H01 - BASIC ELECTRIC ELEMENTS