Helen L. Yeh

Person

Katonah, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Coated means for connecting a chip and a card
- Patent number 6,403,892
- Issue date Jun 11, 2002
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying flex tape protective coating onto a flex product
- Patent number 5,546,655
- Issue date Aug 20, 1996
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flex tape protective coating
- Patent number 5,360,946
- Issue date Nov 1, 1994
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium enhanced soldering and bonding of semiconductor device co...
- Patent number 5,225,711
- Issue date Jul 6, 1993
- International Business Machines Corporation
- Chin-An Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Palladium enhanced fluxless soldering and bonding of semiconductor...
- Patent number 5,048,744
- Issue date Sep 17, 1991
- International Business Machines Corporation
- Chin-An Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In-line process monitors for thin film wiring
- Patent number 4,933,635
- Issue date Jun 12, 1990
- International Business Machines Corporation
- Alina Deutsch
- G01 - MEASURING TESTING
Information Patent Grant
Reduction atmosphere workpiece joining
- Patent number 4,632,295
- Issue date Dec 30, 1986
- International Business Machines Corporation
- Vlasta A. Brusic
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Helen L. Yeh

Person

Patents Grantslast 30 patents

Coated means for connecting a chip and a card

Method of applying flex tape protective coating onto a flex product

Flex tape protective coating

Palladium enhanced soldering and bonding of semiconductor device co...

Palladium enhanced fluxless soldering and bonding of semiconductor...

In-line process monitors for thin film wiring

Reduction atmosphere workpiece joining