Helmut Hadwiger

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Munich, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method for applying a solder resist layer to a printed circuit board
- Patent number 5,134,056
- Issue date Jul 28, 1992
- Siemens Aktiengesellschaft
- Hans-Fr. Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing metal core printed circuit boards
- Patent number 5,044,074
- Issue date Sep 3, 1991
- Siemens Aktiengesellschaft
- Helmut Hadwiger
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for making metal core printed circuit board
- Patent number 4,924,590
- Issue date May 15, 1990
- Siemens Aktiengesellschaft
- Helmut Hadwiger
- B32 - LAYERED PRODUCTS