Helmut Hagleitner

Person

Zebulon, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming vias in silicon carbide and resulting devices and...
- Patent number 10,367,074
- Issue date Jul 30, 2019
- Cree, Inc.
- Zoltan Ring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ohmic contact structure for group III nitride semiconductor device...
- Patent number 10,090,394
- Issue date Oct 2, 2018
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer via plugs with high thermal integrity
- Patent number 10,020,244
- Issue date Jul 10, 2018
- Cree, Inc.
- Van Mieczkowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulation of advanced devices using novel PECVD and ALD schemes
- Patent number 9,812,338
- Issue date Nov 7, 2017
- Cree, Inc.
- Zoltan Ring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Schottky contact
- Patent number 9,640,627
- Issue date May 2, 2017
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved field plate
- Patent number 9,640,623
- Issue date May 2, 2017
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved field plate
- Patent number 9,608,078
- Issue date Mar 28, 2017
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad
- Patent number 9,607,955
- Issue date Mar 28, 2017
- Cree, Inc.
- Van Mieczkowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ohmic contact structure for group III nitride semiconductor device...
- Patent number 9,548,206
- Issue date Jan 17, 2017
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level die attach metallization
- Patent number 9,536,783
- Issue date Jan 3, 2017
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming vias in silicon carbide and resulting devices and...
- Patent number 9,490,169
- Issue date Nov 8, 2016
- Cree, Inc.
- Zoltan Ring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate contact for a semiconductor device and methods of fabrication...
- Patent number 9,343,543
- Issue date May 17, 2016
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using stress reduction barrier sub-layers in a semiconductor die
- Patent number 9,269,662
- Issue date Feb 23, 2016
- Cree, Inc.
- Zoltan Ring
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ohmic contact to semiconductor device
- Patent number 9,214,352
- Issue date Dec 15, 2015
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ni-rich Schottky contact
- Patent number 9,202,703
- Issue date Dec 1, 2015
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer diffusion barriers for wide bandgap Schottky barrier dev...
- Patent number 9,142,631
- Issue date Sep 22, 2015
- Cree, Inc.
- Van Mieczkowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ohmic contact to semiconductor device
- Patent number 9,070,626
- Issue date Jun 30, 2015
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hydrogen mitigation schemes in the passivation of advanced devices
- Patent number 8,994,073
- Issue date Mar 31, 2015
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric solder barrier for semiconductor devices
- Patent number 8,994,182
- Issue date Mar 31, 2015
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate contact for a semiconductor device and methods of fabrication...
- Patent number 8,969,927
- Issue date Mar 3, 2015
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level die attach metallization
- Patent number 8,970,010
- Issue date Mar 3, 2015
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having improved adhesion and methods of fabri...
- Patent number 8,907,350
- Issue date Dec 9, 2014
- Cree, Inc.
- Van Mieczkowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having gates including oxidized nickel
- Patent number 8,896,122
- Issue date Nov 25, 2014
- Cree, Inc.
- Van Mieczkowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric solder barrier for semiconductor devices
- Patent number 8,749,070
- Issue date Jun 10, 2014
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming contact structures including alternating metal a...
- Patent number 8,563,372
- Issue date Oct 22, 2013
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming vias in silicon carbide and resulting devices and...
- Patent number 8,202,796
- Issue date Jun 19, 2012
- Cree, Inc.
- Zoltan Ring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diode having reduced on-resistance and associated method of manufac...
- Patent number 8,138,583
- Issue date Mar 20, 2012
- Cree, Inc.
- Saptharishi Sriram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming vias in silicon carbide and resulting devices and...
- Patent number 7,892,974
- Issue date Feb 22, 2011
- Cree, Inc.
- Zoltan Ring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-rich nickel-silicide ohmic contacts for SiC semiconductor d...
- Patent number 7,875,545
- Issue date Jan 25, 2011
- Cree, Inc.
- Allan Ward, III
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Passivation of wide band-gap based semiconductor devices with hydro...
- Patent number 7,858,460
- Issue date Dec 28, 2010
- Cree, Inc.
- Zoltan Ring
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OHMIC CONTACT STRUCTURE FOR GROUP III NITRIDE SEMICONDUCTOR DEVICE...
- Publication number 20170077254
- Publication date Mar 16, 2017
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING VIAS IN SILICON CARBIDE AND RESULTING DEVICES AND...
- Publication number 20170012106
- Publication date Jan 12, 2017
- Cree, Inc.
- Zoltan Ring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED FIELD PLATE
- Publication number 20160111503
- Publication date Apr 21, 2016
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED FIELD PLATE
- Publication number 20160111502
- Publication date Apr 21, 2016
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CONTACT FOR A SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION...
- Publication number 20150364569
- Publication date Dec 17, 2015
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL DIE ATTACH METALLIZATION
- Publication number 20150140806
- Publication date May 21, 2015
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL DIE ATTACH METALLIZATION
- Publication number 20140264868
- Publication date Sep 18, 2014
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION OF ADVANCED DEVICES USING NOVEL PECVD AND ALD SCHEMES
- Publication number 20140264960
- Publication date Sep 18, 2014
- Cree, Inc.
- Zoltan Ring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CONTACT FOR A SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION...
- Publication number 20140264713
- Publication date Sep 18, 2014
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC SOLDER BARRIER FOR SEMICONDUCTOR DEVICES
- Publication number 20140175664
- Publication date Jun 26, 2014
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NI-RICH SCHOTTKY CONTACT
- Publication number 20140124792
- Publication date May 8, 2014
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING STRESS REDUCTION BARRIER SUB-LAYERS IN A SEMICONDUCTOR DIE
- Publication number 20140103363
- Publication date Apr 17, 2014
- Cree, Inc.
- Zoltan Ring
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HYDROGEN MITIGATION SCHEMES IN THE PASSIVATION OF ADVANCED DEVICES
- Publication number 20140097469
- Publication date Apr 10, 2014
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA PLUGS
- Publication number 20130256841
- Publication date Oct 3, 2013
- Cree, Inc.
- Van Mieczkowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCHOTTKY CONTACT
- Publication number 20130234278
- Publication date Sep 12, 2013
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OHMIC CONTACT TO SEMICONDUCTOR DEVICE
- Publication number 20120175682
- Publication date Jul 12, 2012
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OHMIC CONTACT STRUCTURE FOR GROUP III NITRIDE SEMICONDUCTOR DEVICE...
- Publication number 20120139084
- Publication date Jun 7, 2012
- Cree, Inc.
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PAD
- Publication number 20120115319
- Publication date May 10, 2012
- Cree, Inc.
- Van Mieczkowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Having Gates Including Oxidized Nickel and Re...
- Publication number 20110278590
- Publication date Nov 17, 2011
- Van Mieczkowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Having Improved Adhesion and Methods of Fabri...
- Publication number 20110266557
- Publication date Nov 3, 2011
- Van Mieczkowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER DIFFUSION BARRIERS FOR WIDE BANDGAP SCHOTTKY BARRIER DEV...
- Publication number 20110227089
- Publication date Sep 22, 2011
- Cree, Inc.
- Van Mieczkowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Contact Structures Including Alternating Metal a...
- Publication number 20110193135
- Publication date Aug 11, 2011
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING VIAS IN SILICON CARBIDE AND RESULTING DEVICES AND...
- Publication number 20110165771
- Publication date Jul 7, 2011
- Cree, Inc.
- Zoltan Ring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING VIAS IN SILICON CARBIDE AND RESULTING DEVICES AND...
- Publication number 20110108855
- Publication date May 12, 2011
- Cree, Inc.
- Zoltan Ring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation of Wide Band-Gap Based Semiconductor Devices with Hydro...
- Publication number 20090215280
- Publication date Aug 27, 2009
- Cree, Inc.
- Zoltan Ring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Vias in Silicon Carbide and Resulting Devices and...
- Publication number 20090104738
- Publication date Apr 23, 2009
- Cree, Inc.
- Zoltan Ring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diode Having Reduced On-resistance and Associated Method of Manufac...
- Publication number 20080197360
- Publication date Aug 21, 2008
- Cree, Inc.
- Saptharishi Sriram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon-Rich Nickel-Silicide Ohmic Contacts for SIC Semiconductor D...
- Publication number 20080116464
- Publication date May 22, 2008
- Cree, Inc.
- ALLAN WARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER FOR LIGHT EMITTING DIODES
- Publication number 20080042145
- Publication date Feb 21, 2008
- Helmut Hagleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation of wide band-gap based semiconductor devices with hydro...
- Publication number 20070001174
- Publication date Jan 4, 2007
- Zoltan Ring
- H01 - BASIC ELECTRIC ELEMENTS

Helmut Hagleitner

Person

Patents Grantslast 30 patents

Method of forming vias in silicon carbide and resulting devices and...

Ohmic contact structure for group III nitride semiconductor device...

Polymer via plugs with high thermal integrity

Encapsulation of advanced devices using novel PECVD and ALD schemes

Schottky contact

Semiconductor device with improved field plate

Semiconductor device with improved field plate

Contact pad

Ohmic contact structure for group III nitride semiconductor device...

Wafer-level die attach metallization

Method of forming vias in silicon carbide and resulting devices and...

Gate contact for a semiconductor device and methods of fabrication...

Using stress reduction barrier sub-layers in a semiconductor die

Ohmic contact to semiconductor device

Ni-rich Schottky contact

Multilayer diffusion barriers for wide bandgap Schottky barrier dev...

Ohmic contact to semiconductor device

Hydrogen mitigation schemes in the passivation of advanced devices

Dielectric solder barrier for semiconductor devices

Gate contact for a semiconductor device and methods of fabrication...

Wafer-level die attach metallization

Semiconductor devices having improved adhesion and methods of fabri...

Semiconductor devices having gates including oxidized nickel

Dielectric solder barrier for semiconductor devices

Methods of forming contact structures including alternating metal a...

Method of forming vias in silicon carbide and resulting devices and...

Diode having reduced on-resistance and associated method of manufac...

Method of forming vias in silicon carbide and resulting devices and...

Silicon-rich nickel-silicide ohmic contacts for SiC semiconductor d...

Passivation of wide band-gap based semiconductor devices with hydro...

Patents Applicationslast 30 patents

OHMIC CONTACT STRUCTURE FOR GROUP III NITRIDE SEMICONDUCTOR DEVICE...

METHOD OF FORMING VIAS IN SILICON CARBIDE AND RESULTING DEVICES AND...

SEMICONDUCTOR DEVICE WITH IMPROVED FIELD PLATE

SEMICONDUCTOR DEVICE WITH IMPROVED FIELD PLATE

GATE CONTACT FOR A SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION...

WAFER-LEVEL DIE ATTACH METALLIZATION

WAFER-LEVEL DIE ATTACH METALLIZATION

ENCAPSULATION OF ADVANCED DEVICES USING NOVEL PECVD AND ALD SCHEMES

GATE CONTACT FOR A SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION...

DIELECTRIC SOLDER BARRIER FOR SEMICONDUCTOR DEVICES

NI-RICH SCHOTTKY CONTACT

USING STRESS REDUCTION BARRIER SUB-LAYERS IN A SEMICONDUCTOR DIE

HYDROGEN MITIGATION SCHEMES IN THE PASSIVATION OF ADVANCED DEVICES

VIA PLUGS

SCHOTTKY CONTACT

OHMIC CONTACT TO SEMICONDUCTOR DEVICE

OHMIC CONTACT STRUCTURE FOR GROUP III NITRIDE SEMICONDUCTOR DEVICE...

CONTACT PAD

Semiconductor Devices Having Gates Including Oxidized Nickel and Re...

Semiconductor Devices Having Improved Adhesion and Methods of Fabri...

MULTILAYER DIFFUSION BARRIERS FOR WIDE BANDGAP SCHOTTKY BARRIER DEV...

Methods of Forming Contact Structures Including Alternating Metal a...

METHOD OF FORMING VIAS IN SILICON CARBIDE AND RESULTING DEVICES AND...

METHOD OF FORMING VIAS IN SILICON CARBIDE AND RESULTING DEVICES AND...

Passivation of Wide Band-Gap Based Semiconductor Devices with Hydro...

Method of Forming Vias in Silicon Carbide and Resulting Devices and...

Diode Having Reduced On-resistance and Associated Method of Manufac...

Silicon-Rich Nickel-Silicide Ohmic Contacts for SIC Semiconductor D...

DIFFUSION BARRIER FOR LIGHT EMITTING DIODES

Passivation of wide band-gap based semiconductor devices with hydro...