Helmut Prengel

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Burkau, DE

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Patents Grantslast 30 patents

Information Patent Grant
Automatic resource assignment in stacked module devices
- Patent number 7,286,384
- Issue date Oct 23, 2007
- Advanced Micro Devices, Inc.
- Michael Wendt
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip bond layout for chip carrier for flip chip applications
- Patent number 7,271,495
- Issue date Sep 18, 2007
- Advanced Micro Devices, Inc.
- Helmut Prengel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
OPTIMIZATION OF APPLICATION POWER CONSUMPTION AND PERFORMANCE IN AN...
- Publication number 20100162256
- Publication date Jun 24, 2010
- Alexander Branover
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Automatic resource assignment in devices having stacked modules
- Publication number 20060206745
- Publication date Sep 14, 2006
- Advanced Micro Devices, Inc.
- Helmut Prengel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Automatic resource assignment in stacked module devices
- Publication number 20060202712
- Publication date Sep 14, 2006
- Advanced Micro Devices, Inc.
- Michael Wendt
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Chip bond layout for chip carrier for flip chip applications
- Publication number 20060076691
- Publication date Apr 13, 2006
- Helmut Prengel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR