Helmut Wietschorke

Person

Laberweinting, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Magnetic-sensor device and method for producing same
- Patent number 11,536,781
- Issue date Dec 27, 2022
- Infineon Technologies AG
- Horst Theuss
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor module having a sensor chip and passive devices wit...
- Patent number 11,287,344
- Issue date Mar 29, 2022
- Infineon Technologies AG
- Mathias Vaupel
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor module having a sensor chip and passive devices wit...
- Patent number 10,677,675
- Issue date Jun 9, 2020
- Infineon Technologies AG
- Mathias Vaupel
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for redundantly measuring a magnetic field
- Patent number 10,324,143
- Issue date Jun 18, 2019
- Infineon Technologies AG
- Berthold Astegher
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Pressure sensor module having a sensor chip and passive devices wit...
- Patent number 10,060,819
- Issue date Aug 28, 2018
- Infineon Technologies AG
- Mathias Vaupel
- G01 - MEASURING TESTING
Information Patent Grant
Module and method of manufacturing a module
- Patent number 9,691,687
- Issue date Jun 27, 2017
- Infineon Technologies AG
- Daniel Kehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for redundantly measuring a magnetic field
- Patent number 9,678,174
- Issue date Jun 13, 2017
- Infineon Technologies AG
- Berthold Astegher
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Pressure sensor package with integrated sealing
- Patent number 9,366,593
- Issue date Jun 14, 2016
- Infineon Technologies AG
- Mathias Vaupel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Film-covered open-cavity sensor package
- Patent number 9,153,706
- Issue date Oct 6, 2015
- Infineon Technologies AG
- Klaus Elian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hall sensor arrangement for the redundant measurement of a magnetic...
- Patent number 9,151,809
- Issue date Oct 6, 2015
- Infineon Technologies AG
- Berthold Astegher
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor package having a stacked die arrangement
- Patent number 9,013,013
- Issue date Apr 21, 2015
- Infineon Technologies AG
- Sebastian Beer
- G01 - MEASURING TESTING
Information Patent Grant
Module and method of manufacturing a module
- Patent number 8,749,056
- Issue date Jun 10, 2014
- Infineon Technologies AG
- Daniel Kehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,633,581
- Issue date Jan 21, 2014
- Infineon Technologies AG
- See Beng Keh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 8,535,983
- Issue date Sep 17, 2013
- Infineon Technologies AG
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic sensor integrated circuit device and method
- Patent number 8,106,654
- Issue date Jan 31, 2012
- Infineon Technologies AG
- Horst Theuss
- G01 - MEASURING TESTING
Information Patent Grant
Sensor module with mold encapsulation for applying a bias magnetic...
- Patent number 8,080,993
- Issue date Dec 20, 2011
- Infineon Technologies AG
- Horst Theuss
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Optocoupler for converting optical signals into electrical signals...
- Patent number 7,476,036
- Issue date Jan 13, 2009
- Infineon Technologies AG
- Albert Auburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-optical module with housing and method for producing the same
- Patent number 7,189,009
- Issue date Mar 13, 2007
- Infineon Technologies, AG
- Jochen Dangelmaier
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
MAGNETIC-SENSOR DEVICE AND METHOD FOR PRODUCING SAME
- Publication number 20210341555
- Publication date Nov 4, 2021
- INFINEON TECHNOLOGIES AG
- Horst THEUSS
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSOR MODULE HAVING A SENSOR CHIP AND PASSIVE DEVICES WIT...
- Publication number 20200370983
- Publication date Nov 26, 2020
- INFINEON TECHNOLOGIES AG
- Mathias Vaupel
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSOR MODULE HAVING A SENSOR CHIP AND PASSIVE DEVICES WIT...
- Publication number 20180364123
- Publication date Dec 20, 2018
- INFINEON TECHNOLOGIES AG
- Mathias Vaupel
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS FOR REDUNDANTLY MEASURING A MAGNETIC FIELD
- Publication number 20170269171
- Publication date Sep 21, 2017
- INFINEON TECHNOLOGIES AG
- BERTHOLD ASTEGHER
- G01 - MEASURING TESTING
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE HAVING ENHANCED LOCAL ADHESION CHARACT...
- Publication number 20160282212
- Publication date Sep 29, 2016
- INFINEON TECHNOLOGIES AG
- Sebastian Beer
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSOR MODULE HAVING A SENSOR CHIP AND PASSIVE DEVICES WIT...
- Publication number 20160169763
- Publication date Jun 16, 2016
- INFINEON TECHNOLOGIES AG
- Mathias Vaupel
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS AND A SYSTEM FOR DETECTING A PHYSICAL VARIABLE
- Publication number 20160025529
- Publication date Jan 28, 2016
- INFINEON TECHNOLOGIES AG
- Berthold Astegher
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR REDUNDANTLY MEASURING A MAGNETIC FIELD
- Publication number 20150355292
- Publication date Dec 10, 2015
- INFINEON TECHNOLOGIES AG
- Berthold Astegher
- G01 - MEASURING TESTING
Information Patent Application
Pressure Sensor Package with Integrated Sealing
- Publication number 20150090042
- Publication date Apr 2, 2015
- INFINEON TECHNOLOGIES AG
- Mathias Vaupel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Film-Covered Open-Cavity Sensor Package
- Publication number 20140346623
- Publication date Nov 27, 2014
- Klaus Elian
- G01 - MEASURING TESTING
Information Patent Application
Module and Method of Manufacturing a Module
- Publication number 20140231974
- Publication date Aug 21, 2014
- INFINEON TECHNOLOGIES AG
- Daniel Kehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Semiconductor Device
- Publication number 20120309130
- Publication date Dec 6, 2012
- INFINEON TECHNOLOGIES AG
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module and Method of Manufacturing a Module
- Publication number 20120299170
- Publication date Nov 29, 2012
- Daniel Kehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hall sensor arrangement for the redundant measurement of a magnetic...
- Publication number 20120081109
- Publication date Apr 5, 2012
- INFINEON TECHNOLOGIES AG
- Berthold Astegher
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100230799
- Publication date Sep 16, 2010
- INFINEON TECHNOLOGIES AG
- See Beng Keh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC SENSOR INTEGRATED CIRCUIT DEVICE AND METHOD
- Publication number 20090295381
- Publication date Dec 3, 2009
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- G01 - MEASURING TESTING
Information Patent Application
SENSOR MODULE WITH MOLD ENCAPSULATION FOR APPLYING A BIAS MAGNETIC...
- Publication number 20090243595
- Publication date Oct 1, 2009
- Horst Theuss
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor Sensor
- Publication number 20080308886
- Publication date Dec 18, 2008
- INFINEON TECHNOLOGIES AG
- Udo Ausserlechner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Optocoupler for Converting Optical Signals into Electrical Signals...
- Publication number 20070217734
- Publication date Sep 20, 2007
- Infineon Technologies AG
- Albert Auburger
- G02 - OPTICS
Information Patent Application
Micro-optical module with housing and method for producing the same
- Publication number 20060088256
- Publication date Apr 27, 2006
- Jochen Dangelmaier
- G02 - OPTICS

Helmut Wietschorke

Person

Patents Grantslast 30 patents

Magnetic-sensor device and method for producing same

Pressure sensor module having a sensor chip and passive devices wit...

Pressure sensor module having a sensor chip and passive devices wit...

Apparatus for redundantly measuring a magnetic field

Pressure sensor module having a sensor chip and passive devices wit...

Module and method of manufacturing a module

Method for redundantly measuring a magnetic field

Pressure sensor package with integrated sealing

Film-covered open-cavity sensor package

Hall sensor arrangement for the redundant measurement of a magnetic...

Pressure sensor package having a stacked die arrangement

Module and method of manufacturing a module

Semiconductor device

Method of manufacturing a semiconductor device

Magnetic sensor integrated circuit device and method

Sensor module with mold encapsulation for applying a bias magnetic...

Optocoupler for converting optical signals into electrical signals...

Micro-optical module with housing and method for producing the same

Patents Applicationslast 30 patents

MAGNETIC-SENSOR DEVICE AND METHOD FOR PRODUCING SAME

PRESSURE SENSOR MODULE HAVING A SENSOR CHIP AND PASSIVE DEVICES WIT...

PRESSURE SENSOR MODULE HAVING A SENSOR CHIP AND PASSIVE DEVICES WIT...

APPARATUS FOR REDUNDANTLY MEASURING A MAGNETIC FIELD

MOLDED SEMICONDUCTOR PACKAGE HAVING ENHANCED LOCAL ADHESION CHARACT...

PRESSURE SENSOR MODULE HAVING A SENSOR CHIP AND PASSIVE DEVICES WIT...

APPARATUS AND A SYSTEM FOR DETECTING A PHYSICAL VARIABLE

METHOD FOR REDUNDANTLY MEASURING A MAGNETIC FIELD

Pressure Sensor Package with Integrated Sealing

Film-Covered Open-Cavity Sensor Package

Module and Method of Manufacturing a Module

Method of Manufacturing a Semiconductor Device

Module and Method of Manufacturing a Module

Hall sensor arrangement for the redundant measurement of a magnetic...

SEMICONDUCTOR DEVICE

MAGNETIC SENSOR INTEGRATED CIRCUIT DEVICE AND METHOD

SENSOR MODULE WITH MOLD ENCAPSULATION FOR APPLYING A BIAS MAGNETIC...

Semiconductor Sensor

Optocoupler for Converting Optical Signals into Electrical Signals...

Micro-optical module with housing and method for producing the same