Helmuth Treichel

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Augsburg, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method for metallizing submicron contact holes in semiconductor bodies
- Patent number 6,057,229
- Issue date May 2, 2000
- Siemens Aktiengesellschaft
- Konrad Hieber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing microcrystalline cubic boron-nitride-layers
- Patent number 5,629,053
- Issue date May 13, 1997
- Siemens Aktiengesellschaft
- Helmuth Treichel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for producing conductive layers or structures...
- Patent number 5,478,780
- Issue date Dec 26, 1995
- Siemens Aktiengesellschaft
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing silicon boronitride layers
- Patent number 4,990,365
- Issue date Feb 5, 1991
- Siemens Aktiengesellschaft
- Helmuth Treichel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of producing a defined arsenic doping in silicon semiconduct...
- Patent number 4,755,486
- Issue date Jul 5, 1988
- Siemens Aktiengesellschaft
- Helmuth Treichel
- H01 - BASIC ELECTRIC ELEMENTS