Hemant D. Desai

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer level micro-electro-mechanical systems package with accelerom...
- Patent number 9,726,689
- Issue date Aug 8, 2017
- Hanking Electronics Ltd.
- Hemant Desai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for an isolating structure
- Patent number 9,409,765
- Issue date Aug 9, 2016
- Maxim Integrated Products, Inc.
- Hemant Desai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for an integrated isolation mechanical filter...
- Patent number 9,250,262
- Issue date Feb 2, 2016
- Maxim Integrated Products, Inc.
- Hemant Desai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including accelerometer devices
- Patent number 9,233,836
- Issue date Jan 12, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device assembly and method of packaging same
- Patent number 9,131,325
- Issue date Sep 8, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Mark E. Schlarmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming an integrated circuit having varying substrate depth
- Patent number 8,921,203
- Issue date Dec 30, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure with a moving portion and a buried electrode for movement...
- Patent number 8,692,337
- Issue date Apr 8, 2014
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Audrey Berthelot
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Attaching a MEMS to a bonding wafer
- Patent number 8,652,865
- Issue date Feb 18, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Eutectic flow containment in a semiconductor fabrication process
- Patent number 8,525,316
- Issue date Sep 3, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS sensor device with multi-stimulus sensing
- Patent number 8,487,387
- Issue date Jul 16, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Yizhen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device structures for in-plane and out-of-plane sensing micro-elect...
- Patent number 8,461,656
- Issue date Jun 11, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Woo Tae Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS pressure sensor device and method of fabricating same
- Patent number 8,316,718
- Issue date Nov 27, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Yizhen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of producing a microelectromechanical (MEMS) sensor device
- Patent number 8,216,882
- Issue date Jul 10, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Yizhen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of anti-stiction dimple formation under MEMS
- Patent number 7,919,006
- Issue date Apr 5, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Woo Tae Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Eutectic flow containment in a semiconductor fabrication process
- Patent number 7,846,815
- Issue date Dec 7, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming a seal for a semiconductor device
- Patent number 7,585,744
- Issue date Sep 8, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Bishnu P. Gogoi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate contact for a capped MEMS and method of making the substr...
- Patent number 7,316,965
- Issue date Jan 8, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
LIQUID COOLING SYSTEM LEAK DETECTION IMPROVEMENTS
- Publication number 20220196507
- Publication date Jun 23, 2022
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT HAVING VARYING SUBSTRATE DEPTH AND METHOD OF FOR...
- Publication number 20150084138
- Publication date Mar 26, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE LEVEL ADJUSTMENT IN A CAVITY OF A SEMICONDUCTOR DIE
- Publication number 20140225206
- Publication date Aug 14, 2014
- Yizhen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT HAVING VARYING SUBSTRATE DEPTH AND METHOD OF FOR...
- Publication number 20130285161
- Publication date Oct 31, 2013
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCTION OF A STRUCTURE WITH A BURIED ELECTRODE BY DIR...
- Publication number 20130175643
- Publication date Jul 11, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Audrey Berthelot
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ATTACHING A MEMS TO A BONDING WAFER
- Publication number 20130043564
- Publication date Feb 21, 2013
- LISA H. KARLIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR DEVICE WITH MULTI-STIMULUS SENSING
- Publication number 20120256282
- Publication date Oct 11, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Yizhen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE ASSEMBLY AND METHOD OF PACKAGING SAME
- Publication number 20120175747
- Publication date Jul 12, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Mark E. Schlarmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF PRODUCING LAYERED WAFER STRUCTURE HAVING ANTI-STICTION BUMPS
- Publication number 20120107992
- Publication date May 3, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Sensor Device With Multi-Stimulus Sensing and Method of Fabric...
- Publication number 20120043627
- Publication date Feb 23, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Yizhen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Pressure Sensor Device and Method of Fabricating Same
- Publication number 20120042731
- Publication date Feb 23, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Yizhen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR MAKING IN-PLANE AND OUT-OF-PLANE SENSING MICRO-ELECTRO-...
- Publication number 20120001277
- Publication date Jan 5, 2012
- Woo Tae Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EUTECTIC FLOW CONTAINMENT IN A SEMICONDUCTOR FABRICATION PROCESS
- Publication number 20110042761
- Publication date Feb 24, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EUTECTIC FLOW CONTAINMENT IN A SEMICONDUCTOR FABRICATION PROCESS
- Publication number 20100244159
- Publication date Sep 30, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Lisa H. Karlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF ANTI-STICTION DIMPLE FORMATION UNDER MEMS
- Publication number 20090111267
- Publication date Apr 30, 2009
- Woo Tae Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS device and method of fabrication
- Publication number 20070090474
- Publication date Apr 26, 2007
- Gary G. Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Substrate contact for a capped MEMS and method of making the substr...
- Publication number 20060286707
- Publication date Dec 21, 2006
- Stephen R. Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of making a substrate contact for a capped MEMS at the packa...
- Publication number 20060286706
- Publication date Dec 21, 2006
- Arvind S. Salian
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Hemant D. Desai

Person

Patents Grantslast 30 patents

Wafer level micro-electro-mechanical systems package with accelerom...

Method and apparatus for an isolating structure

Method and apparatus for an integrated isolation mechanical filter...

Semiconductor device including accelerometer devices

MEMS device assembly and method of packaging same

Method of forming an integrated circuit having varying substrate depth

Structure with a moving portion and a buried electrode for movement...

Attaching a MEMS to a bonding wafer

Eutectic flow containment in a semiconductor fabrication process

MEMS sensor device with multi-stimulus sensing

Device structures for in-plane and out-of-plane sensing micro-elect...

MEMS pressure sensor device and method of fabricating same

Method of producing a microelectromechanical (MEMS) sensor device

Method of anti-stiction dimple formation under MEMS

Eutectic flow containment in a semiconductor fabrication process

Method of forming a seal for a semiconductor device

Substrate contact for a capped MEMS and method of making the substr...

Patents Applicationslast 30 patents

LIQUID COOLING SYSTEM LEAK DETECTION IMPROVEMENTS

INTEGRATED CIRCUIT HAVING VARYING SUBSTRATE DEPTH AND METHOD OF FOR...

PRESSURE LEVEL ADJUSTMENT IN A CAVITY OF A SEMICONDUCTOR DIE

INTEGRATED CIRCUIT HAVING VARYING SUBSTRATE DEPTH AND METHOD OF FOR...

METHOD FOR PRODUCTION OF A STRUCTURE WITH A BURIED ELECTRODE BY DIR...

ATTACHING A MEMS TO A BONDING WAFER

MEMS SENSOR DEVICE WITH MULTI-STIMULUS SENSING

MEMS DEVICE ASSEMBLY AND METHOD OF PACKAGING SAME

METHOD OF PRODUCING LAYERED WAFER STRUCTURE HAVING ANTI-STICTION BUMPS

MEMS Sensor Device With Multi-Stimulus Sensing and Method of Fabric...

MEMS Pressure Sensor Device and Method of Fabricating Same

METHODS FOR MAKING IN-PLANE AND OUT-OF-PLANE SENSING MICRO-ELECTRO-...

EUTECTIC FLOW CONTAINMENT IN A SEMICONDUCTOR FABRICATION PROCESS

EUTECTIC FLOW CONTAINMENT IN A SEMICONDUCTOR FABRICATION PROCESS

METHOD OF ANTI-STICTION DIMPLE FORMATION UNDER MEMS

MEMS device and method of fabrication

Substrate contact for a capped MEMS and method of making the substr...

Method of making a substrate contact for a capped MEMS at the packa...