Hemanth K. Dhavaleswarapu

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having sealant bridge
- Patent number 11,676,873
- Issue date Jun 13, 2023
- Intel Corporation
- Dinesh Padmanabhan Ramalekshmi Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader edge standoffs for managing bondline thickness in mic...
- Patent number 11,652,018
- Issue date May 16, 2023
- Intel Corporation
- Dinesh P. R. Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader edge standoffs for managing bondline thickness in mic...
- Patent number 11,062,970
- Issue date Jul 13, 2021
- Intel Corporation
- Dinesh P. R. Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standoff spacers for managing bondline thickness in microelectronic...
- Patent number 10,643,938
- Issue date May 5, 2020
- Intel Corporation
- Dinesh P. R. Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple-chip package with multiple thermal interface materials
- Patent number 10,580,717
- Issue date Mar 3, 2020
- Intel Corporation
- Boxi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance transient uniform cooling solution for thermal com...
- Patent number 9,943,931
- Issue date Apr 17, 2018
- Intel Corporation
- Zhihua Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compression bonding process cooling manifold
- Patent number 9,748,199
- Issue date Aug 29, 2017
- Intel Corporation
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management for flexible integrated circuit packages
- Patent number 9,735,089
- Issue date Aug 15, 2017
- Intel Corporation
- Siddarth Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced expansion thermal compression bonding process bond head
- Patent number 9,548,284
- Issue date Jan 17, 2017
- Intel Corporation
- Pramod Malatkar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
High performance transient uniform cooling solution for thermal com...
- Patent number 9,434,029
- Issue date Sep 6, 2016
- Intel Corporation
- Zhihua Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compression bonding process cooling manifold
- Patent number 9,282,650
- Issue date Mar 8, 2016
- Intel Corporation
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTI-LEVEL DIE COUPLED WITH A SUBSTRATE
- Publication number 20220415770
- Publication date Dec 29, 2022
- Intel Corporation
- Omkar KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MIC...
- Publication number 20210305118
- Publication date Sep 30, 2021
- Intel Corporation
- Dinesh P. R. Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING SEALANT BRIDGE
- Publication number 20200185290
- Publication date Jun 11, 2020
- Intel Corporation
- Dinesh PADMANABHAN RAMALEKSHMI THANU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MIC...
- Publication number 20190067153
- Publication date Feb 28, 2019
- Intel Corporation
- Dinesh P. R. Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SOLUTION DESIGNS FOR MICROELECTRONIC PACKAGES
- Publication number 20190006259
- Publication date Jan 3, 2019
- Intel Corporation
- Dinesh Padmanabhan Ramalekshmi Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE-CHIP PACKAGE WITH MULTIPLE THERMAL INTERFACE MATERIALS
- Publication number 20180374776
- Publication date Dec 27, 2018
- Intel Corporation
- Boxi LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDOFF SPACERS FOR MANAGING BONDLINE THICKNESS IN MICROELECTRONIC...
- Publication number 20180350712
- Publication date Dec 6, 2018
- Intel Corporation
- Dinesh P. R. Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT FOR FLEXIBLE INTEGRATED CIRCUIT PACKAGES
- Publication number 20170092564
- Publication date Mar 30, 2017
- Intel Corporation
- Siddarth Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COM...
- Publication number 20170014957
- Publication date Jan 19, 2017
- Intel Corporation
- Zhihua Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD
- Publication number 20160211238
- Publication date Jul 21, 2016
- Intel Corporation
- Hemanth Dhavaleswarapu
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD
- Publication number 20150173209
- Publication date Jun 18, 2015
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCED EXPANSION THERMAL COMPRESSION BONDING PROCESS BOND HEAD
- Publication number 20150171047
- Publication date Jun 18, 2015
- Intel Corporation
- Pramod Malatkar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED HEAT SPREADER FOR MULTICHIP PACKAGES
- Publication number 20150170989
- Publication date Jun 18, 2015
- Hemanth K. Dhavaleswarapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COM...
- Publication number 20130299133
- Publication date Nov 14, 2013
- Zhihua Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Hemanth K. Dhavaleswarapu

Person

Patents Grantslast 30 patents

Semiconductor package having sealant bridge

Heat spreader edge standoffs for managing bondline thickness in mic...

Heat spreader edge standoffs for managing bondline thickness in mic...

Standoff spacers for managing bondline thickness in microelectronic...

Multiple-chip package with multiple thermal interface materials

High performance transient uniform cooling solution for thermal com...

Thermal compression bonding process cooling manifold

Thermal management for flexible integrated circuit packages

Reduced expansion thermal compression bonding process bond head

High performance transient uniform cooling solution for thermal com...

Thermal compression bonding process cooling manifold

Patents Applicationslast 30 patents

MULTI-LEVEL DIE COUPLED WITH A SUBSTRATE

HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MIC...

SEMICONDUCTOR PACKAGE HAVING SEALANT BRIDGE

HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MIC...

COOLING SOLUTION DESIGNS FOR MICROELECTRONIC PACKAGES

MULTIPLE-CHIP PACKAGE WITH MULTIPLE THERMAL INTERFACE MATERIALS

STANDOFF SPACERS FOR MANAGING BONDLINE THICKNESS IN MICROELECTRONIC...

THERMAL MANAGEMENT FOR FLEXIBLE INTEGRATED CIRCUIT PACKAGES

HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COM...

THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD

THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD

REDUCED EXPANSION THERMAL COMPRESSION BONDING PROCESS BOND HEAD

THREE-DIMENSIONAL (3D) INTEGRATED HEAT SPREADER FOR MULTICHIP PACKAGES

HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COM...