Hendrik BOUMAN

Person

Nijmegen, NL

People

Patents Grantslast 30 patents

Information Patent Grant
Sensor package and method of producing the sensor package
- Patent number 12,180,066
- Issue date Dec 31, 2024
- Sciosense B.V.
- Willem Frederik Adrianus Besling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package and method of producing the sensor package
- Patent number 11,001,495
- Issue date May 11, 2021
- Sciosense B.V.
- Willem Frederik Adrianus Besling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package for environmental parameter sensors and method for manufact...
- Patent number 10,192,842
- Issue date Jan 29, 2019
- AMS International AG
- Hendrik Bouman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure
- Patent number 9,862,600
- Issue date Jan 9, 2018
- ams International AG
- Roel Daamen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die interconnect
- Patent number 9,385,099
- Issue date Jul 5, 2016
- NXP, B.V.
- Leonardus Antonius Elisabeth van Gemert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit with sensor and method of manufacturing such an...
- Patent number 9,070,695
- Issue date Jun 30, 2015
- NXP, B.V.
- Roel Daamen
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Sensor Package and Method of Producing the Sensor Package
- Publication number 20210229981
- Publication date Jul 29, 2021
- Sciosense B.V.
- Willem Frederik Adrianus Besling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Pressure Sensor Module
- Publication number 20210055177
- Publication date Feb 25, 2021
- ams AG
- Roel DAAMEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGE AND METHOD OF PRODUCING THE SENSOR PACKAGE
- Publication number 20190375628
- Publication date Dec 12, 2019
- ams International AG
- Willem Frederik Adrianus BESLING
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP STRUCTURE
- Publication number 20160340180
- Publication date Nov 24, 2016
- ams International AG
- Roel Daamen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE INTERCONNECT
- Publication number 20150279803
- Publication date Oct 1, 2015
- NXP B.V.
- Leonardus Antonius Elisabeth van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD
- Publication number 20150171042
- Publication date Jun 18, 2015
- NXP B.V.
- Hendrik Bouman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH SENSOR AND METHOD OF MANUFACTURING SUCH AN...
- Publication number 20130069176
- Publication date Mar 21, 2013
- NXP B.V.
- Roel DAAMEN
- G01 - MEASURING TESTING

Hendrik BOUMAN

Person

Patents Grantslast 30 patents

Sensor package and method of producing the sensor package

Sensor package and method of producing the sensor package

Package for environmental parameter sensors and method for manufact...

Chip structure

Die interconnect

Integrated circuit with sensor and method of manufacturing such an...

Patents Applicationslast 30 patents

Sensor Package and Method of Producing the Sensor Package

Pressure Sensor Module

SENSOR PACKAGE AND METHOD OF PRODUCING THE SENSOR PACKAGE

CHIP STRUCTURE

DIE INTERCONNECT

SENSOR PACKAGE AND MANUFACTURING METHOD

INTEGRATED CIRCUIT WITH SENSOR AND METHOD OF MANUFACTURING SUCH AN...