Hendrik Hochstenbach

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Nijmegen, NL

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Patents Grantslast 30 patents

Information Patent Grant
Reinforced structure for a stack of layers in a semiconductor compo...
- Patent number 9,466,579
- Issue date Oct 11, 2016
- NXP B.V.
- Hendrik Pieter Hochstenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced bottom roughness of stress buffering element of a semicondu...
- Patent number 8,350,385
- Issue date Jan 8, 2013
- NXP B.V.
- Hendrik Hochstenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress buffering package for a semiconductor component
- Patent number 8,338,967
- Issue date Dec 25, 2012
- NXP B.V.
- Hendrik P. Hochstenbach
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of assembly and assembly thus made
- Patent number 8,268,672
- Issue date Sep 18, 2012
- NXP B.V.
- Nicolaas Johannes Anthonius Van Veen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing same
- Patent number 7,196,416
- Issue date Mar 27, 2007
- NXP B.V.
- Hendrik Pieter Hochstenbach
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of Assembly and Assembly Thus Made
- Publication number 20110275176
- Publication date Nov 10, 2011
- Nicolaas Johannes Anthonius Van Veen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIREBONDING PROCESS
- Publication number 20110192885
- Publication date Aug 11, 2011
- NXP B.V.
- Hendrik Pieter HOCHSTENBACH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS BUFFERING PACKAGE FOR A SEMICONDUCTOR COMPONENT
- Publication number 20100224987
- Publication date Sep 9, 2010
- NXP B.V.
- Hendrik P. Hochstenbach
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REINFORCED STRUCTURE FOR A STACK OF LAYERS IN A SEMICONDUCTOR COMPO...
- Publication number 20100193945
- Publication date Aug 5, 2010
- NXP B.V.
- Hendrik Pieter Hochstenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED BOTTOM ROUGHNESS OF STRESS BUFFERING ELEMENT OF A SEMICONDU...
- Publication number 20100187688
- Publication date Jul 29, 2010
- NXP B.V.
- Hendrik Hochstenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device and method of manufacturing same
- Publication number 20060099742
- Publication date May 11, 2006
- Koninklijke Philips Electronics N.V.
- Hendrik Pieter Hochstenbach
- H01 - BASIC ELECTRIC ELEMENTS